Materials / Compare
PCB Board FR-4, 2 copper planes vs. Plastic Polycarbonate
Compare PCB Board FR-4, 2 copper planes vs. Plastic Polycarbonate strength, stiffness, weight and thermal properties.
| Try it on a partA sample part to run stress or thermal on, free in your browser | Open in LessCAD | Open in LessCAD |
|---|---|---|
| Mechanical | ||
| Yield strength | not given (tensile used) | 65MPasourcetypical, tensile yield |
| Ultimate tensile strength | 246–385MPasourcethe bare laminate's (fr4-370hr), in-plane: cross direction .. length direction (ASTM D3039) | 65MPasourcetypical, stress at break |
| Flexural strength | not sourced | 97MPasourcetypical, flexural strength |
| Elongation at break | not sourced | 125%sourcetypical, strain at break |
| Young's modulus (stiffness) | 21.9–25.8GPasourcethe bare laminate's (fr4-370hr), in-plane: cross direction .. length direction (ASTM D790-15e2); the copper planes are left out | 2.4GPasourcetypical |
| Density | not sourced | 1,200kg/m³sourcetypical |
| Strength to weight | not sourced | 54.2kN·m/kg |
| Stiffness to weight | not sourced | 2MN·m/kg |
| Poisson's ratio | 0.171–0.177sourcethe bare laminate's (fr4-370hr), in-plane: cross direction .. length direction | 0.38sourcetypical, polycarbonate family (Covestro Part and Mold Design guide, Table 3-1) |
| Shear modulus | 10.2GPa11.7x stiffer in shear | 0.87GPa |
| Bulk modulus | 12.2GPa | 3.33GPa |
| Speed of sound | not sourced | 1,414m/s |
| Thermal | ||
| Thermal conductivity | not sourced | 0.2W/m·Ksourcetypical, through-plane, 23 C |
| Thermal expansion | 13–14µm/m·Ksourcethe bare laminate's (fr4-370hr), in-plane X/Y-axis, below Tg (IPC-TM-650 2.4.24C) | 65µm/m·Ksourcetypical, 23-55 C, parallel and normal |
| 100 mm part over a 50 °C swing | 67.5µm growth4.81x less | 325µm growth |
| Specific heat | not sourced | 1,172J/kg·Ksourcetypical (guide value), Bayer ASTM datasheet for Makrolon 2405, ASTM D 2766 |
| Heats up and cools (diffusivity) | not sourced | 0.142mm²/s |
| Thermal shock resistance | not sourced | 51.7W/m |
| Glass transition | not sourced | 144°Csourcetypical, DSC 10 C/min |
| Max service temperature | not sourced | 125°CsourceUL 746B RTI, tensile strength, 1.5 mm |
| Values for | A whole circuit board read as one orthotropic plate: the JEDEC high-K thermal test board (JESD51-7, "2s2p"), 0.062 in (1.575 mm) thick with two internal solid copper planes 0.0014 in (1 oz) thick, as Texas Instruments SZZA017A Table 1 gives it. Copper C110 and the Isola 370HR laminate from this library; the layers conduct in parallel along the board and in series through it (boardStackup.ts). Its two 0.0028 in trace layers cover little of the board and are left out; vias are ignored. Mechanical values are the bare laminate's. | Covestro Makrolon 2405 general-purpose PC (MVR 19), Covestro technical datasheet version 2026-09-28, typical values |
Every value links to the document that states it. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.
Questions
Is PCB Board FR-4, 2 copper planes stronger than Plastic Polycarbonate?
PCB Board FR-4, 2 copper planes is stronger: its tensile strength is 315 MPa against yield strength 65 MPa for Plastic Polycarbonate (4.85x).
Which is stiffer, PCB Board FR-4, 2 copper planes or Plastic Polycarbonate?
PCB Board FR-4, 2 copper planes is stiffer: Young's modulus 23.9 GPa against 2.4 GPa for Plastic Polycarbonate, so the same part in PCB Board FR-4, 2 copper planes deflects less under the same load.
Which expands less with temperature?
PCB Board FR-4, 2 copper planes expands less: 13.5 µm/m·K against 65 µm/m·K for Plastic Polycarbonate.
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