Materials / Compare
DMLS AlSi10Mg Aluminum vs. FDM HIPS
Compare DMLS AlSi10Mg Aluminum vs. FDM HIPS strength, stiffness, weight and thermal properties.
| Try it on a partA bracket to run stress or thermal on, free in your browser | Open in LessCAD | Open in LessCAD |
|---|---|---|
| Mechanical | ||
| Yield strength | 270MPasourcetypical, as manufactured, horizontal | not given (tensile used) |
| Ultimate tensile strength | 450MPasourcetypical, as manufactured, horizontal | 18.4MPasourcetypical |
| Flexural strength | not sourced | 31.8MPasourcetypical |
| Elongation at break | 10.2%sourcetypical at break, as manufactured, horizontal | 1.4%sourcetypical |
| Young's modulus (stiffness) | 72GPasourcesame material and process, different machine maker: Renishaw RenAM 500, 30 µm, as built, horizontal (XY) | 1.59GPasourcetypical |
| Density | 2,670kg/m³sourcetypical part density (ISO 3369), EOS M 290, AlSi10Mg_030_FlexM291 (30 µm) | 1,023kg/m³sourcetypical |
| Strength to weight | 101kN·m/kg5.62x higher | 18kN·m/kg |
| Stiffness to weight | 27MN·m/kg17.4x higher | 1.55MN·m/kg |
| Poisson's ratio | 0.33sourcebase material: cast Al-Si-Mg alloy 359.0 (Al-9Si-0.6Mg, closest MIL-HDBK-5J alloy to AlSi10Mg / EN AC-43000) | not sourced |
| Shear modulus | 27.1GPa | not sourced |
| Bulk modulus | 70.6GPa | not sourced |
| Speed of sound | 5,193m/s | 1,246m/s |
| Thermal | ||
| Thermal conductivity | 110W/m·Ksourcetypical, as manufactured, horizontal (ISO 22007-2) | 0.17W/m·Ksourcebase material: INEOS Styrolution PS 486N injection-molding HIPS, typical |
| Thermal expansion | 20µm/m·Ksourcemean 25-100 °C, ASTM E228 | 80µm/m·Ksourcebase material: INEOS Styrolution PS 486N injection-molding HIPS, typical |
| 100 mm part over a 50 °C swing | 100µm growth4x less | 400µm growth |
| Specific heat | 963J/kg·Ksourcebase material: cast Al-Si-Mg alloy 359.0 (MIL-HDBK-5J), at 100 °C | not sourced |
| Heats up and cools (diffusivity) | 42.8mm²/s | not sourced |
| Thermal shock resistance | 13,819W/m | not sourced |
| Glass transition | not sourced | 99°Csourcetypical |
| Max service temperature | not sourced | 86°CsourceHDT 1.8 MPa |
| Values for | EOS Aluminium AlSi10Mg (powder 9011-0024), EOS M 290 | 30 µm process (AlSi10Mg_FlexM291 2.01), as manufactured, horizontal; machined (turned) specimens, ISO 6892-1 B10 | BASF Forward AM (BASF 3D Printing Solutions) Ultrafuse HiPS, TDS v2.2 (13.11.2019), printed specimens, XY 'Flat'. Specimen print settings are not stated; recommended processing on the sheet: nozzle 240-260 °C, bed 100-120 °C, 40-80 mm/s. Product is discontinued (Forward AM product page) but the TDS is still served by Forward AM. |
Every value links to the document that states it. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.
DMLS AlSi10Mg Aluminum and FDM HIPS are 3D printed: their properties depend on build direction and print settings; these are typical values.
Questions
Is DMLS AlSi10Mg Aluminum stronger than FDM HIPS?
DMLS AlSi10Mg Aluminum is stronger: its yield strength is 270 MPa against tensile strength 18.4 MPa for FDM HIPS (14.7x).
Which is lighter, DMLS AlSi10Mg Aluminum or FDM HIPS?
FDM HIPS is lighter: 1,023 kg/m³ against 2,670 kg/m³ for DMLS AlSi10Mg Aluminum.
Which is stiffer, DMLS AlSi10Mg Aluminum or FDM HIPS?
DMLS AlSi10Mg Aluminum is stiffer: Young's modulus 72 GPa against 1.59 GPa for FDM HIPS, so the same part in DMLS AlSi10Mg Aluminum deflects less under the same load.
Which is lighter for the same job, DMLS AlSi10Mg Aluminum or FDM HIPS?
For the same stiffness or strength: DMLS AlSi10Mg Aluminum is lighter for a stiff rod or tie (tension), stiff beam (bending), stiff panel or plate, strong rod or tie, strong beam, strong panel or plate.
| Part that must be | DMLS AlSi10Mg Aluminum | FDM HIPS |
|---|---|---|
| Stiff rod or tie (tension) | lighter | 17.4x heavier |
| Stiff beam (bending) | lighter | 2.58x heavier |
| Stiff panel or plate | lighter | 37% heavier |
| Strong rod or tie | lighter | 5.62x heavier |
| Strong beam | lighter | 2.3x heavier |
| Strong panel or plate | lighter | 47% heavier |
For the same stiffness or strength, mass scales with density over stiffness (or strength) raised to a power set by how the part is loaded: 1 for a rod in tension, 1/2 for a beam in bending, 1/3 for a panel (the standard material-selection indices).
Which conducts heat better, DMLS AlSi10Mg Aluminum or FDM HIPS?
DMLS AlSi10Mg Aluminum conducts heat better: 110 W/m·K against 0.17 W/m·K for FDM HIPS.
Which expands less with temperature?
DMLS AlSi10Mg Aluminum expands less: 20 µm/m·K against 80 µm/m·K for FDM HIPS.