Thermal conductivity against densityHigher and further left: spreads more heat for its weightThermal expansion against thermal conductivityLower and further right: warps less when heated
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3003-O (annealed) aluminium-manganese alloy, the heat-exchanger tube and brazing alloy, Kaiser Aluminum Tube & Pipe Alloy 3003 Technical Data (Rev. 05/06), typical properties; specific heat from the NIST cryogenic 3003-F fit at 293 K.
PCB Board FR-4, 2 copper planes
A whole circuit board read as one orthotropic plate: the JEDEC high-K thermal test board (JESD51-7, "2s2p"), 0.062 in (1.575 mm) thick with two internal solid copper planes 0.0014 in (1 oz) thick, as Texas Instruments SZZA017A Table 1 gives it. Copper C110 and the Isola 370HR laminate from this library; the layers conduct in parallel along the board and in series through it (boardStackup.ts). Its two 0.0028 in trace layers cover little of the board and are left out; vias are ignored. Mechanical values are the bare laminate's.
1
Alloy 3003 Tube & Pipe Technical Data, Rev. 05/06Kaiser Aluminumarchived copyAluminum 3003-O · Yield strength: typical, O, 0.0625 in specimenAluminum 3003-O · Ultimate tensile strength: typical, OAluminum 3003-O · Elongation at break: typical, O, in 4DAluminum 3003-O · Young's modulus (stiffness): typicalAluminum 3003-O · Density: nominal, 20 °CAluminum 3003-O · Thermal conductivity: typical, O, 20 °CAluminum 3003-O · Thermal expansion: typical, mean 20-100 °CAluminum 3003-O · Melting point: melting range
2
370HR Laminate and Prepreg Data SheetIsolaarchived copyPCB Board FR-4, 2 copper planes · Ultimate tensile strength: the bare laminate's (fr4-370hr), in-plane: cross direction .. length direction (ASTM D3039)PCB Board FR-4, 2 copper planes · Young's modulus (stiffness): the bare laminate's (fr4-370hr), in-plane: cross direction .. length direction (ASTM D790-15e2); the copper planes are left outPCB Board FR-4, 2 copper planes · Poisson's ratio: the bare laminate's (fr4-370hr), in-plane: cross direction .. length directionPCB Board FR-4, 2 copper planes · Thermal expansion: the bare laminate's (fr4-370hr), in-plane X/Y-axis, below Tg (IPC-TM-650 2.4.24C)
Each number points to the document that states it, with the exact basis. Values without a number are computed from the sourced ones. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.
Questions
Mechanical
Is Aluminum 3003-O stronger than PCB Board FR-4, 2 copper planes?
PCB Board FR-4, 2 copper planes is stronger: its tensile strength is 315 MPa against yield strength 40 MPa for Aluminum 3003-O (7.88x).
Which is stiffer, Aluminum 3003-O or PCB Board FR-4, 2 copper planes?
Aluminum 3003-O is stiffer: Young's modulus 69 GPa against 23.9 GPa for PCB Board FR-4, 2 copper planes, so the same part in Aluminum 3003-O deflects less under the same load.
Thermal
Which expands less with temperature?
PCB Board FR-4, 2 copper planes expands less: 13.5 µm/m·K against 23.2 µm/m·K for Aluminum 3003-O.