Aluminum 5052-H32 vs. Solder SAC305

Compare Aluminum 5052-H32 vs. Solder SAC305 strength, stiffness, weight and thermal properties.

Change either side

Mechanical
Try it on a partA bracket to run stress or thermal on, free in your browser	Open in LessCAD	Open in LessCAD
Yield strength	195MPasourcetypical, 0.2% offset	22MPasourcetypical
Ultimate tensile strength	230MPasourcetypical5.81x stronger	39.6MPasourcetypical
Elongation at break	12%sourcetypical	49%sourcetypical4.08x more ductile
Young's modulus (stiffness)	70GPasourcetypical	6.9GPasourcetypical, temperature and strain rate not stated
Density	2,685kg/m³sourcenominal	7,350kg/m³sourcetypical
Strength to weight	72.6kN·m/kg24.3x higher	2.99kN·m/kg
Stiffness to weight	26.1MN·m/kg27.8x higher	0.939MN·m/kg
Poisson's ratio	0.33sourcetypical (handbook physical constant)	0.35sourcetypical
Shear modulus	26.3GPa10.3x stiffer in shear	2.56GPa
Bulk modulus	68.6GPa	7.67GPa
Speed of sound	5,106m/s	969m/s
Thermal
Thermal conductivity	138W/m·Ksourcebase material: 5052 in O temper (same alloy, annealed); Kaiser typical	61W/m·Ksourcetypical, temperature not stated
Thermal expansion	23.8µm/m·Ksourcetypical, mean 20-100 °C	21.9µm/m·Ksourcemean, 20-100 °C (MacDermid Alpha)
100 mm part over a 50 °C swing	119µm growth	110µm growth9% less
Specific heat	963J/kg·Ksourceat 100 °C (212 °F); table covers O, H32, H34, H36, H38	232J/kg·Ksourcetypical (MacDermid Alpha)
Heats up and cools (diffusivity)	53.4mm²/s49% faster	35.8mm²/s
Thermal shock resistance	10,822W/m1.87x more resistant	5,773W/m
Melting point	605–650°Csourcemelting range	217–220°Csourcesolidus-liquidus
Values for	5052-H32, Kaiser Aluminum tube & pipe typical datasheet (mechanical, CTE, melting); MIL-HDBK-5J (Poisson, density, specific heat)	SAC305 (Sn96.5Ag3.0Cu0.5) solder alloy, bulk; Indium Corporation Indalloy 256 (SAC305) for Preforms product data sheet (Form No. 100346 R0, 2024), selected properties, test temperature not stated; expansion and specific heat from MacDermid Alpha VACULOY SAC TDS (06 September 2023).

Every value links to the document that states it. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.

Questions

Is Aluminum 5052-H32 stronger than Solder SAC305?

Aluminum 5052-H32 is stronger: its yield strength is 195 MPa against 22 MPa for Solder SAC305 (8.86x).

Which is lighter, Aluminum 5052-H32 or Solder SAC305?

Aluminum 5052-H32 is lighter: 2,685 kg/m³ against 7,350 kg/m³ for Solder SAC305.

Which is stiffer, Aluminum 5052-H32 or Solder SAC305?

Aluminum 5052-H32 is stiffer: Young's modulus 70 GPa against 6.9 GPa for Solder SAC305, so the same part in Aluminum 5052-H32 deflects less under the same load.

Which is lighter for the same job, Aluminum 5052-H32 or Solder SAC305?

For the same stiffness or strength: Aluminum 5052-H32 is lighter for a stiff rod or tie (tension), stiff beam (bending), stiff panel or plate, strong rod or tie, strong beam, strong panel or plate.

Part that must be	Aluminum 5052-H32	Solder SAC305
Stiff rod or tie (tension)	lighter	27.8x heavier
Stiff beam (bending)	lighter	8.72x heavier
Stiff panel or plate	lighter	5.93x heavier
Strong rod or tie	lighter	24.3x heavier
Strong beam	lighter	11.7x heavier
Strong panel or plate	lighter	8.15x heavier

For the same stiffness or strength, mass scales with density over stiffness (or strength) raised to a power set by how the part is loaded: 1 for a rod in tension, 1/2 for a beam in bending, 1/3 for a panel (the standard material-selection indices).

Which is more ductile, Aluminum 5052-H32 or Solder SAC305?

Solder SAC305 stretches further before it breaks: 49% elongation at break against 12% for Aluminum 5052-H32.

Which conducts heat better, Aluminum 5052-H32 or Solder SAC305?

Aluminum 5052-H32 conducts heat better: 138 W/m·K against 61 W/m·K for Solder SAC305.

Which expands less with temperature?

Solder SAC305 expands less: 21.9 µm/m·K against 23.8 µm/m·K for Aluminum 5052-H32.

Among 72 materials

Stiffness against density

Strength against density