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Brick vs. PCB Board FR-4, 2 copper planes

Compare Brick vs. PCB Board FR-4, 2 copper planes strength, stiffness, weight and thermal properties.

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BrickNatural
PCB Board FR-4, 2 copper planesComposite
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Mechanical
Yield strengthnot given (tensile used)not given (tensile used)
Ultimate tensile strength5.1MPasourcemodulus of rupture (no direct tensile value)246–385MPasourcethe bare laminate's (fr4-370hr), in-plane: cross direction .. length direction (ASTM D3039)
Compressive strength77.9MPasourcemean unit compressive strength, solid extruded brick (survey mean; SD 30.8 MPa)not sourced
Elongation at breaknot sourcednot sourced
Young's modulus (stiffness)not sourced21.9–25.8GPasourcethe bare laminate's (fr4-370hr), in-plane: cross direction .. length direction (ASTM D790-15e2); the copper planes are left out
Density2,082kg/m³sourceface brick density row used for k (BIA notes most fired clay brick 120-130 lb/ft3)not sourced
Strength to weight2.45kN·m/kgnot sourced
Stiffness to weightnot sourcednot sourced
Poisson's rationot sourced0.171–0.177sourcethe bare laminate's (fr4-370hr), in-plane: cross direction .. length direction
Shear modulusnot sourced10.2GPa
Bulk modulusnot sourced12.2GPa
Speed of soundnot sourcednot sourced
Thermal
Thermal conductivity0.92–1.12W/m·Ksourcerange for 130 lb/ft3 face brick (ASHRAE 2013 via BIA)not sourced
Thermal expansion7.2µm/m·KsourceTMS Code average coefficient, clay/shale unit masonry13–14µm/m·Ksourcethe bare laminate's (fr4-370hr), in-plane X/Y-axis, below Tg (IPC-TM-650 2.4.24C)
100 mm part over a 50 °C swing36µm growth1.87x less67.5µm growth
Specific heat837J/kg·Ksourcevalue used in BIA heat-capacity sample calculationnot sourced
Heats up and cools (diffusivity)0.585mm²/snot sourced
Thermal shock resistancenot sourcednot sourced
Values forSolid extruded clay/shale brick units (BIA 1993 manufacturer survey, TN 3A 2024); face brick of 130 lb/ft3 for thermal properties (BIA TN 4, from ASHRAE 2013); CTE is the TMS Code value for clay/shale masonryA whole circuit board read as one orthotropic plate: the JEDEC high-K thermal test board (JESD51-7, "2s2p"), 0.062 in (1.575 mm) thick with two internal solid copper planes 0.0014 in (1 oz) thick, as Texas Instruments SZZA017A Table 1 gives it. Copper C110 and the Isola 370HR laminate from this library; the layers conduct in parallel along the board and in series through it (boardStackup.ts). Its two 0.0028 in trace layers cover little of the board and are left out; vias are ignored. Mechanical values are the bare laminate's.

Every value links to the document that states it. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.

Questions

Is Brick stronger than PCB Board FR-4, 2 copper planes?

PCB Board FR-4, 2 copper planes is stronger: its tensile strength is 315 MPa against 5.1 MPa for Brick (61.8x).

Which expands less with temperature?

Brick expands less: 7.2 µm/m·K against 13.5 µm/m·K for PCB Board FR-4, 2 copper planes.

Among 73 materials

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Stiffness against density
1k10k101001kDensity (kg/m³)Yield strength (MPa)Plastic PLAPlastic PETGPlastic ABSPlastic TPUPlastic NylonRubberAluminumSteelIronTitaniumSteel AISI 1018Stainless Steel 304Stainless Steel 316Aluminum 6061-T6Aluminum 7075-T6Brass C360Copper C110GlassSteel AISI 1045Steel AISI 4340Steel A992Stainless Steel 303Stainless Steel 17-4PHAluminum 2024-T351Aluminum 5052-H32Aluminum 7050-T7451Titanium Ti-6Al-4VBrass C260Nickel Inconel 718Magnesium AZ31B-H24Zinc Zamak 3Plastic ABS (bulk/injection)Plastic PolycarbonatePlastic POM/AcetalPlastic Nylon PA6Plastic Nylon PA66Plastic PEEKPlastic PTFEPlastic UHMWPEPlastic HDPEPlastic PolypropylenePlastic PMMAFDM ASAFDM PolycarbonateFDM PAHT-CFFDM HIPSSLA Resin Tough 2000SLA Resin Elastic 50ASLS PA12 NylonDMLS AlSi10Mg AluminumDMLS Ti-6Al-4V ELI TitaniumDMLS 316L Stainless SteelDMLS 17-4PH Stainless SteelPCB Laminate FR-4SiliconCeramic Alumina 96%Aluminum A380Aluminum 6063-T6Aluminum 1100-OAluminum ADC12Magnesium AZ91DSolder SAC305Plastic PBT GF30Plastic PPS GF40Plastic LCP GF30Brick
Strength against density

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