Thermal conductivity against densityHigher and further left: spreads more heat for its weightThermal expansion against thermal conductivityLower and further right: warps less when heated
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C10100 oxygen-free electronic (OFE) copper, annealed to 0.050 mm grain size (OS050), 0.04 in. flat products, copper.org typical values
FDM HIPS
BASF Forward AM (BASF 3D Printing Solutions) Ultrafuse HiPS, TDS v2.2 (13.11.2019), printed specimens, XY 'Flat'. Specimen print settings are not stated; recommended processing on the sheet: nozzle 240-260 °C, bed 100-120 °C, 40-80 mm/s. Product is discontinued (Forward AM product page) but the TDS is still served by Forward AM.
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C10100 Alloy (copper.org)Copper Development Associationarchived copyCopper C10100 · Yield strength: typical, 0.5% extension under load, 0.04 in. flatCopper C10100 · Ultimate tensile strength: typical, 0.04 in. flatCopper C10100 · Elongation at break: typical, 0.04 in. flatCopper C10100 · Young's modulus (stiffness): typicalCopper C10100 · Density: nominalCopper C10100 · Thermal conductivity: typical, 20 °CCopper C10100 · Thermal expansion: typical, mean 20-100 °CCopper C10100 · Specific heat: typical, 20 °CCopper C10100 · Melting point: melting point (liquidus = solidus, pure copper)
Each number points to the document that states it, with the exact basis. Values without a number are computed from the sourced ones. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.
FDM HIPS is 3D printed: its properties depend on build direction and print settings; these are typical values.
Questions
Mechanical
Is Copper C10100 stronger than FDM HIPS?
Copper C10100 is stronger: its yield strength is 69 MPa against tensile strength 18.4 MPa for FDM HIPS (3.75x).
Which is lighter, Copper C10100 or FDM HIPS?
FDM HIPS is lighter: 1,023 kg/m³ against 8,941 kg/m³ for Copper C10100.
Which is stiffer, Copper C10100 or FDM HIPS?
Copper C10100 is stiffer: Young's modulus 117 GPa against 1.59 GPa for FDM HIPS, so the same part in Copper C10100 deflects less under the same load.
Which is lighter for the same job, Copper C10100 or FDM HIPS?
For the same stiffness or strength: Copper C10100 is lighter for a stiff rod or tie (tension); FDM HIPS is lighter for a stiff beam (bending), stiff panel or plate, strong rod or tie, strong beam, strong panel or plate.
Part that must be
Copper C10100
FDM HIPS
Stiff rod or tie (tension)
lighter
8.44x heavier
Stiff beam (bending)
2% heavier
lighter
Stiff panel or plate
2.08x heavier
lighter
Strong rod or tie
2.33x heavier
lighter
Strong beam
3.62x heavier
lighter
Strong panel or plate
4.51x heavier
lighter
For the same stiffness or strength, mass scales with density over stiffness (or strength) raised to a power set by how the part is loaded: 1 for a rod in tension, 1/2 for a beam in bending, 1/3 for a panel (the standard material-selection indices).
Which is more ductile, Copper C10100 or FDM HIPS?
Copper C10100 stretches further before it breaks: 45% elongation at break against 1.4% for FDM HIPS.
Thermal
Which conducts heat better, Copper C10100 or FDM HIPS?
Copper C10100 conducts heat better: 391 W/m·K against 0.17 W/m·K for FDM HIPS.
Which expands less with temperature?
Copper C10100 expands less: 16.9 µm/m·K against 80 µm/m·K for FDM HIPS.