Thermal conductivity against densityHigher and further left: spreads more heat for its weightThermal expansion against thermal conductivityLower and further right: warps less when heated
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Sources3 documents: Copper Development Association, BASF, Wieland
Copper C10100
C10100 oxygen-free electronic (OFE) copper, annealed to 0.050 mm grain size (OS050), 0.04 in. flat products, copper.org typical values
Plastic PBT GF30
BASF Ultradur B 4300 G6 (PBT, 30% glass fibre), injection moulding grade; product information sheet 09/2026, typical values for uncoloured product at 23 °C.
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C10100 Alloy (copper.org)Copper Development Associationarchived copyCopper C10100 · Yield strength: typical, 0.5% extension under load, 0.04 in. flatCopper C10100 · Ultimate tensile strength: typical, 0.04 in. flatCopper C10100 · Elongation at break: typical, 0.04 in. flatCopper C10100 · Young's modulus (stiffness): typicalCopper C10100 · Density: nominalCopper C10100 · Thermal conductivity: typical, 20 °CCopper C10100 · Thermal expansion: typical, mean 20-100 °CCopper C10100 · Specific heat: typical, 20 °CCopper C10100 · Melting point: melting point (liquidus = solidus, pure copper)
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Ultradur B 4300 G6 Product InformationBASFPlastic PBT GF30 · Ultimate tensile strength: stress at break, 23 °CPlastic PBT GF30 · Flexural strength: typical, 23 °CPlastic PBT GF30 · Elongation at break: strain at break, 23 °CPlastic PBT GF30 · Young's modulus (stiffness): typical, 23 °CPlastic PBT GF30 · Density: typicalPlastic PBT GF30 · Thermal conductivity: typical (DIN 52612-1)Plastic PBT GF30 · Thermal expansion: longitudinal (flow), mean 23-55 °CPlastic PBT GF30 · Specific heat: typical, 23 °CPlastic PBT GF30 · Melting point: DSC (ISO 11357)Plastic PBT GF30 · Max service temperature: HDT 1.8 MPa
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Wieland-K09 (Cu-OFE, C10100) Data SheetWielandCopper C10100 · Poisson's ratio: reference value at room temperature (Wieland-K09 = Cu-OFE = C10100, rolled products)
Each number points to the document that states it, with the exact basis. Values without a number are computed from the sourced ones. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.
Questions
Mechanical
Is Copper C10100 stronger than Plastic PBT GF30?
Plastic PBT GF30 is stronger: its tensile strength is 140 MPa against yield strength 69 MPa for Copper C10100 (2.03x).
Which is lighter, Copper C10100 or Plastic PBT GF30?
Plastic PBT GF30 is lighter: 1,530 kg/m³ against 8,941 kg/m³ for Copper C10100.
Which is stiffer, Copper C10100 or Plastic PBT GF30?
Copper C10100 is stiffer: Young's modulus 117 GPa against 9.8 GPa for Plastic PBT GF30, so the same part in Copper C10100 deflects less under the same load.
Which is lighter for the same job, Copper C10100 or Plastic PBT GF30?
For the same stiffness or strength: Copper C10100 is lighter for a stiff rod or tie (tension); Plastic PBT GF30 is lighter for a stiff beam (bending), stiff panel or plate, strong rod or tie, strong beam, strong panel or plate.
Part that must be
Copper C10100
Plastic PBT GF30
Stiff rod or tie (tension)
lighter
2.05x heavier
Stiff beam (bending)
1.69x heavier
lighter
Stiff panel or plate
2.56x heavier
lighter
Strong rod or tie
11.9x heavier
lighter
Strong beam
9.37x heavier
lighter
Strong panel or plate
8.32x heavier
lighter
For the same stiffness or strength, mass scales with density over stiffness (or strength) raised to a power set by how the part is loaded: 1 for a rod in tension, 1/2 for a beam in bending, 1/3 for a panel (the standard material-selection indices).
Which is more ductile, Copper C10100 or Plastic PBT GF30?
Copper C10100 stretches further before it breaks: 45% elongation at break against 3% for Plastic PBT GF30.
Thermal
Which conducts heat better, Copper C10100 or Plastic PBT GF30?
Copper C10100 conducts heat better: 391 W/m·K against 0.27 W/m·K for Plastic PBT GF30.
Which expands less with temperature?
Copper C10100 expands less: 16.9 µm/m·K against 25 µm/m·K for Plastic PBT GF30.