Thermal conductivity against densityHigher and further left: spreads more heat for its weightThermal expansion against thermal conductivityLower and further right: warps less when heated
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Sources5 documents: Copper Development Association, Formlabs, Wieland
Copper C10100
C10100 oxygen-free electronic (OFE) copper, annealed to 0.050 mm grain size (OS050), 0.04 in. flat products, copper.org typical values
SLA Resin Standard
Formlabs Clear Resin V5 (FLGPCL05), TDS Rev. 01 March 20, 2024; printed on Form 4 at 100 µm, washed 5 min in >=99% IPA, post-cured 15 min at 60 °C in Form Cure. Orientation not stated.
1
C10100 Alloy (copper.org)Copper Development Associationarchived copyCopper C10100 · Yield strength: typical, 0.5% extension under load, 0.04 in. flatCopper C10100 · Ultimate tensile strength: typical, 0.04 in. flatCopper C10100 · Elongation at break: typical, 0.04 in. flatCopper C10100 · Young's modulus (stiffness): typicalCopper C10100 · Density: nominalCopper C10100 · Thermal conductivity: typical, 20 °CCopper C10100 · Thermal expansion: typical, mean 20-100 °CCopper C10100 · Specific heat: typical, 20 °CCopper C10100 · Melting point: melting point (liquidus = solidus, pure copper)
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Clear Resin V5 Technical Data Sheet (2024)Formlabsarchived copySLA Resin Standard · Ultimate tensile strength: typicalSLA Resin Standard · Flexural strength: typicalSLA Resin Standard · Elongation at break: typicalSLA Resin Standard · Young's modulus (stiffness): typicalSLA Resin Standard · Max service temperature: HDT 1.8 MPa
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Clear Resin V5 Technical Data Sheet (web edition)FormlabsSLA Resin Standard · Density: typical, post-cured (same for 5 min ambient and 15 min at 60 °C), ASTM D792
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Wieland-K09 (Cu-OFE, C10100) Data SheetWielandCopper C10100 · Poisson's ratio: reference value at room temperature (Wieland-K09 = Cu-OFE = C10100, rolled products)
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Thermal Properties of Selected Formlabs SLA ResinsFormlabsSLA Resin Standard · Thermal conductivity: typical, post-cured, ASTM E1530SLA Resin Standard · Thermal expansion: mean -30 to 140 °C, post-cured (5 min ambient cure), TMA ASTM E831SLA Resin Standard · Specific heat: typical, 25 °C, post-cured (5 min ambient cure), DSC ASTM E1269
Each number points to the document that states it, with the exact basis. Values without a number are computed from the sourced ones. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.
SLA Resin Standard is 3D printed: its properties depend on build direction and print settings; these are typical values.
Questions
Mechanical
Is Copper C10100 stronger than SLA Resin Standard?
Copper C10100 is stronger: its yield strength is 69 MPa against tensile strength 60 MPa for SLA Resin Standard (15%).
Which is lighter, Copper C10100 or SLA Resin Standard?
SLA Resin Standard is lighter: 1,210 kg/m³ against 8,941 kg/m³ for Copper C10100.
Which is stiffer, Copper C10100 or SLA Resin Standard?
Copper C10100 is stiffer: Young's modulus 117 GPa against 2.75 GPa for SLA Resin Standard, so the same part in Copper C10100 deflects less under the same load.
Which is lighter for the same job, Copper C10100 or SLA Resin Standard?
For the same stiffness or strength: Copper C10100 is lighter for a stiff rod or tie (tension); SLA Resin Standard is lighter for a stiff beam (bending), stiff panel or plate, strong rod or tie, strong beam, strong panel or plate.
Part that must be
Copper C10100
SLA Resin Standard
Stiff rod or tie (tension)
lighter
5.77x heavier
Stiff beam (bending)
13% heavier
lighter
Stiff panel or plate
2.12x heavier
lighter
Strong rod or tie
6.43x heavier
lighter
Strong beam
6.73x heavier
lighter
Strong panel or plate
6.89x heavier
lighter
For the same stiffness or strength, mass scales with density over stiffness (or strength) raised to a power set by how the part is loaded: 1 for a rod in tension, 1/2 for a beam in bending, 1/3 for a panel (the standard material-selection indices).
Which is more ductile, Copper C10100 or SLA Resin Standard?
Copper C10100 stretches further before it breaks: 45% elongation at break against 8% for SLA Resin Standard.
Thermal
Which conducts heat better, Copper C10100 or SLA Resin Standard?
Copper C10100 conducts heat better: 391 W/m·K against 0.54 W/m·K for SLA Resin Standard.
Which expands less with temperature?
Copper C10100 expands less: 16.9 µm/m·K against 114 µm/m·K for SLA Resin Standard.