Materials / Compare
Copper C110 vs. DMLS AlSi10Mg Aluminum
Compare Copper C110 vs. DMLS AlSi10Mg Aluminum strength, stiffness, weight and thermal properties.
| Try it on a partA bracket to run stress or thermal on, free in your browser | Open in LessCAD | Open in LessCAD |
|---|---|---|
| Mechanical | ||
| Yield strength | 69MPasourcetypical, 0.5% extension under load | 270MPasourcetypical, as manufactured, horizontal |
| Ultimate tensile strength | 221MPasourcetypical | 450MPasourcetypical, as manufactured, horizontal |
| Elongation at break | 55%sourcetypical, 1 in. rod | 10.2%sourcetypical at break, as manufactured, horizontal |
| Young's modulus (stiffness) | 117GPasourcetypical | 72GPasourcesame material and process, different machine maker: Renishaw RenAM 500, 30 µm, as built, horizontal (XY) |
| Density | 8,913kg/m³sourcenominal | 2,670kg/m³sourcetypical part density (ISO 3369), EOS M 290, AlSi10Mg_030_FlexM291 (30 µm) |
| Strength to weight | 7.74kN·m/kg | 101kN·m/kg13.1x higher |
| Stiffness to weight | 13.1MN·m/kg | 27MN·m/kg2.05x higher |
| Poisson's ratio | 0.34sourcereference value at room temperature (Wieland-K32 = Cu-ETP = C11000, rolled products) | 0.33sourcebase material: cast Al-Si-Mg alloy 359.0 (Al-9Si-0.6Mg, closest MIL-HDBK-5J alloy to AlSi10Mg / EN AC-43000) |
| Shear modulus | 43.7GPa1.62x stiffer in shear | 27.1GPa |
| Bulk modulus | 122GPa | 70.6GPa |
| Speed of sound | 3,626m/s | 5,193m/s |
| Thermal | ||
| Thermal conductivity | 391W/m·Ksourcetypical, 20 °C | 110W/m·Ksourcetypical, as manufactured, horizontal (ISO 22007-2) |
| Thermal expansion | 16.9µm/m·Ksourcetypical, mean 20-100 °C | 20µm/m·Ksourcemean 25-100 °C, ASTM E228 |
| 100 mm part over a 50 °C swing | 84.5µm growth18% less | 100µm growth |
| Specific heat | 385J/kg·Ksourcetypical, 20 °C | 963J/kg·Ksourcebase material: cast Al-Si-Mg alloy 359.0 (MIL-HDBK-5J), at 100 °C |
| Heats up and cools (diffusivity) | 114mm²/s2.66x faster | 42.8mm²/s |
| Thermal shock resistance | 8,992W/m | 13,819W/m1.54x more resistant |
| Melting point | 1,065–1,083°Csourcesolidus-liquidus | not sourced |
| Values for | C11000 ETP copper, annealed to 0.050 mm grain size (OS050), 1 in. rod, copper.org typical values | EOS Aluminium AlSi10Mg (powder 9011-0024), EOS M 290 | 30 µm process (AlSi10Mg_FlexM291 2.01), as manufactured, horizontal; machined (turned) specimens, ISO 6892-1 B10 |
Every value links to the document that states it. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.
DMLS AlSi10Mg Aluminum is 3D printed: its properties depend on build direction and print settings; these are typical values.
Questions
Is Copper C110 stronger than DMLS AlSi10Mg Aluminum?
DMLS AlSi10Mg Aluminum is stronger: its yield strength is 270 MPa against 69 MPa for Copper C110 (3.91x).
Which is lighter, Copper C110 or DMLS AlSi10Mg Aluminum?
DMLS AlSi10Mg Aluminum is lighter: 2,670 kg/m³ against 8,913 kg/m³ for Copper C110.
Which is stiffer, Copper C110 or DMLS AlSi10Mg Aluminum?
Copper C110 is stiffer: Young's modulus 117 GPa against 72 GPa for DMLS AlSi10Mg Aluminum, so the same part in Copper C110 deflects less under the same load.
Which is lighter for the same job, Copper C110 or DMLS AlSi10Mg Aluminum?
For the same stiffness or strength: DMLS AlSi10Mg Aluminum is lighter for a stiff rod or tie (tension), stiff beam (bending), stiff panel or plate, strong rod or tie, strong beam, strong panel or plate.
| Part that must be | Copper C110 | DMLS AlSi10Mg Aluminum |
|---|---|---|
| Stiff rod or tie (tension) | 2.05x heavier | lighter |
| Stiff beam (bending) | 2.62x heavier | lighter |
| Stiff panel or plate | 2.84x heavier | lighter |
| Strong rod or tie | 13.1x heavier | lighter |
| Strong beam | 8.29x heavier | lighter |
| Strong panel or plate | 6.6x heavier | lighter |
For the same stiffness or strength, mass scales with density over stiffness (or strength) raised to a power set by how the part is loaded: 1 for a rod in tension, 1/2 for a beam in bending, 1/3 for a panel (the standard material-selection indices).
Which conducts heat better, Copper C110 or DMLS AlSi10Mg Aluminum?
Copper C110 conducts heat better: 391 W/m·K against 110 W/m·K for DMLS AlSi10Mg Aluminum.
Which expands less with temperature?
Copper C110 expands less: 16.9 µm/m·K against 20 µm/m·K for DMLS AlSi10Mg Aluminum.