Copper C110 vs. Solder SAC305

Compare Copper C110 vs. Solder SAC305 strength, stiffness, weight and thermal properties.

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Mechanical
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Yield strength	69MPasourcetypical, 0.5% extension under load	22MPasourcetypical
Ultimate tensile strength	221MPasourcetypical5.58x stronger	39.6MPasourcetypical
Elongation at break	55%sourcetypical, 1 in. rod	49%sourcetypical
Young's modulus (stiffness)	117GPasourcetypical	6.9GPasourcetypical, temperature and strain rate not stated
Density	8,913kg/m³sourcenominal	7,350kg/m³sourcetypical
Strength to weight	7.74kN·m/kg2.59x higher	2.99kN·m/kg
Stiffness to weight	13.1MN·m/kg14x higher	0.939MN·m/kg
Poisson's ratio	0.34sourcereference value at room temperature (Wieland-K32 = Cu-ETP = C11000, rolled products)	0.35sourcetypical
Shear modulus	43.7GPa17.1x stiffer in shear	2.56GPa
Bulk modulus	122GPa	7.67GPa
Speed of sound	3,626m/s	969m/s
Thermal
Thermal conductivity	391W/m·Ksourcetypical, 20 °C	61W/m·Ksourcetypical, temperature not stated
Thermal expansion	16.9µm/m·Ksourcetypical, mean 20-100 °C	21.9µm/m·Ksourcemean, 20-100 °C (MacDermid Alpha)
100 mm part over a 50 °C swing	84.5µm growth30% less	110µm growth
Specific heat	385J/kg·Ksourcetypical, 20 °C	232J/kg·Ksourcetypical (MacDermid Alpha)
Heats up and cools (diffusivity)	114mm²/s3.18x faster	35.8mm²/s
Thermal shock resistance	8,992W/m1.56x more resistant	5,773W/m
Melting point	1,065–1,083°Csourcesolidus-liquidus	217–220°Csourcesolidus-liquidus
Values for	C11000 ETP copper, annealed to 0.050 mm grain size (OS050), 1 in. rod, copper.org typical values	SAC305 (Sn96.5Ag3.0Cu0.5) solder alloy, bulk; Indium Corporation Indalloy 256 (SAC305) for Preforms product data sheet (Form No. 100346 R0, 2024), selected properties, test temperature not stated; expansion and specific heat from MacDermid Alpha VACULOY SAC TDS (06 September 2023).

Every value links to the document that states it. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.

Questions

Is Copper C110 stronger than Solder SAC305?

Copper C110 is stronger: its yield strength is 69 MPa against 22 MPa for Solder SAC305 (3.14x).

Which is lighter, Copper C110 or Solder SAC305?

Solder SAC305 is lighter: 7,350 kg/m³ against 8,913 kg/m³ for Copper C110.

Which is stiffer, Copper C110 or Solder SAC305?

Copper C110 is stiffer: Young's modulus 117 GPa against 6.9 GPa for Solder SAC305, so the same part in Copper C110 deflects less under the same load.

Which is lighter for the same job, Copper C110 or Solder SAC305?

For the same stiffness or strength: Copper C110 is lighter for a stiff rod or tie (tension), stiff beam (bending), stiff panel or plate, strong rod or tie, strong beam, strong panel or plate.

Part that must be	Copper C110	Solder SAC305
Stiff rod or tie (tension)	lighter	14x heavier
Stiff beam (bending)	lighter	3.4x heavier
Stiff panel or plate	lighter	2.12x heavier
Strong rod or tie	lighter	2.59x heavier
Strong beam	lighter	1.77x heavier
Strong panel or plate	lighter	46% heavier

For the same stiffness or strength, mass scales with density over stiffness (or strength) raised to a power set by how the part is loaded: 1 for a rod in tension, 1/2 for a beam in bending, 1/3 for a panel (the standard material-selection indices).

Which conducts heat better, Copper C110 or Solder SAC305?

Copper C110 conducts heat better: 391 W/m·K against 61 W/m·K for Solder SAC305.

Which expands less with temperature?

Copper C110 expands less: 16.9 µm/m·K against 21.9 µm/m·K for Solder SAC305.

Among 72 materials

Stiffness against density

Strength against density