Bambu Lab ASA, TDS V3.0, printed specimens X-Y; nozzle 260 °C, bed 80 °C, 200 mm/s, 100% infill; annealed and dried 80 °C for 12 h before testing.
SAC305 (Sn96.5Ag3.0Cu0.5) solder alloy, bulk; Indium Corporation Indalloy 256 (SAC305) for Preforms product data sheet (Form No. 100346 R0, 2024), selected properties, test temperature not stated; expansion and specific heat from MacDermid Alpha VACULOY SAC TDS (06 September 2023).
Every value links to the document that states it. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.
FDM ASA is 3D printed: its properties depend on build direction and print settings; these are typical values.
Questions
Is FDM ASA stronger than Solder SAC305?
FDM ASA is stronger: its tensile strength is 37 MPa against yield strength 22 MPa for Solder SAC305 (1.68x).
Which is lighter, FDM ASA or Solder SAC305?
FDM ASA is lighter: 1,050 kg/m³ against 7,350 kg/m³ for Solder SAC305.
Which is stiffer, FDM ASA or Solder SAC305?
Solder SAC305 is stiffer: Young's modulus 6.9 GPa against 2.45 GPa for FDM ASA, so the same part in Solder SAC305 deflects less under the same load.
Which is lighter for the same job, FDM ASA or Solder SAC305?
For the same stiffness or strength: FDM ASA is lighter for a stiff rod or tie (tension), stiff beam (bending), stiff panel or plate, strong rod or tie, strong beam, strong panel or plate.
Part that must be
FDM ASA
Solder SAC305
Stiff rod or tie (tension)
lighter
2.49x heavier
Stiff beam (bending)
lighter
4.17x heavier
Stiff panel or plate
lighter
4.96x heavier
Strong rod or tie
lighter
11.8x heavier
Strong beam
lighter
9.9x heavier
Strong panel or plate
lighter
9.08x heavier
For the same stiffness or strength, mass scales with density over stiffness (or strength) raised to a power set by how the part is loaded: 1 for a rod in tension, 1/2 for a beam in bending, 1/3 for a panel (the standard material-selection indices).
Which is more ductile, FDM ASA or Solder SAC305?
Solder SAC305 stretches further before it breaks: 49% elongation at break against 9.2% for FDM ASA.
Which conducts heat better, FDM ASA or Solder SAC305?
Solder SAC305 conducts heat better: 61 W/m·K against 0.17 W/m·K for FDM ASA.
Which expands less with temperature?
Solder SAC305 expands less: 21.9 µm/m·K against 95 µm/m·K for FDM ASA.