FDM HIPS vs. PCB Board FR-4, 2 copper planes

Compare FDM HIPS vs. PCB Board FR-4, 2 copper planes strength, stiffness, weight and thermal properties.

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FDM HIPS3D printed (FDM)

PCB Board FR-4, 2 copper planesComposite

Mechanical
Try it on a partA sample part to run stress or thermal on, free in your browser	Open in LessCAD	Open in LessCAD
Yield strength	not given (tensile used)	not given (tensile used)
Ultimate tensile strength	18.4MPasourcetypical	246–385MPasourcethe bare laminate's (fr4-370hr), in-plane: cross direction .. length direction (ASTM D3039)
Flexural strength	31.8MPasourcetypical	not sourced
Elongation at break	1.4%sourcetypical	not sourced
Young's modulus (stiffness)	1.59GPasourcetypical	21.9–25.8GPasourcethe bare laminate's (fr4-370hr), in-plane: cross direction .. length direction (ASTM D790-15e2); the copper planes are left out
Density	1,023kg/m³sourcetypical	not sourced
Strength to weight	18kN·m/kg	not sourced
Stiffness to weight	1.55MN·m/kg	not sourced
Poisson's ratio	not sourced	0.171–0.177sourcethe bare laminate's (fr4-370hr), in-plane: cross direction .. length direction
Shear modulus	not sourced	10.2GPa
Bulk modulus	not sourced	12.2GPa
Speed of sound	1,246m/s	not sourced
Thermal
Thermal conductivity	0.17W/m·Ksourcebase material: INEOS Styrolution PS 486N injection-molding HIPS, typical	not sourced
Thermal expansion	80µm/m·Ksourcebase material: INEOS Styrolution PS 486N injection-molding HIPS, typical	13–14µm/m·Ksourcethe bare laminate's (fr4-370hr), in-plane X/Y-axis, below Tg (IPC-TM-650 2.4.24C)
100 mm part over a 50 °C swing	400µm growth	67.5µm growth5.93x less
Specific heat	not sourced	not sourced
Heats up and cools (diffusivity)	not sourced	not sourced
Thermal shock resistance	not sourced	not sourced
Glass transition	99°Csourcetypical	not sourced
Max service temperature	86°CsourceHDT 1.8 MPa	not sourced
Values for	BASF Forward AM (BASF 3D Printing Solutions) Ultrafuse HiPS, TDS v2.2 (13.11.2019), printed specimens, XY 'Flat'. Specimen print settings are not stated; recommended processing on the sheet: nozzle 240-260 °C, bed 100-120 °C, 40-80 mm/s. Product is discontinued (Forward AM product page) but the TDS is still served by Forward AM.	A whole circuit board read as one orthotropic plate: the JEDEC high-K thermal test board (JESD51-7, "2s2p"), 0.062 in (1.575 mm) thick with two internal solid copper planes 0.0014 in (1 oz) thick, as Texas Instruments SZZA017A Table 1 gives it. Copper C110 and the Isola 370HR laminate from this library; the layers conduct in parallel along the board and in series through it (boardStackup.ts). Its two 0.0028 in trace layers cover little of the board and are left out; vias are ignored. Mechanical values are the bare laminate's.

Every value links to the document that states it. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.

FDM HIPS is 3D printed: its properties depend on build direction and print settings; these are typical values.

Questions

Is FDM HIPS stronger than PCB Board FR-4, 2 copper planes?

PCB Board FR-4, 2 copper planes is stronger: its tensile strength is 315 MPa against 18.4 MPa for FDM HIPS (17.1x).

Which is stiffer, FDM HIPS or PCB Board FR-4, 2 copper planes?

PCB Board FR-4, 2 copper planes is stiffer: Young's modulus 23.9 GPa against 1.59 GPa for FDM HIPS, so the same part in PCB Board FR-4, 2 copper planes deflects less under the same load.

Which expands less with temperature?

PCB Board FR-4, 2 copper planes expands less: 13.5 µm/m·K against 80 µm/m·K for FDM HIPS.

Among 73 materials

Stiffness against density

Strength against density