Materials / Compare
FDM HIPS vs. Zinc Zamak 3
Compare FDM HIPS vs. Zinc Zamak 3 strength, stiffness, weight and thermal properties.
| Try it on a partA bracket to run stress or thermal on, free in your browser | Open in LessCAD | Open in LessCAD |
|---|---|---|
| Mechanical | ||
| Yield strength | not given (tensile used) | 221MPasourcetypical |
| Ultimate tensile strength | 18.4MPasourcetypical | 283MPasourcetypical15.4x stronger |
| Flexural strength | 31.8MPasourcetypical | not sourced |
| Elongation at break | 1.4%sourcetypical | 10%sourcetypical, in 2 in. |
| Young's modulus (stiffness) | 1.59GPasourcetypical | 85.5GPasourcetypical53.8x stiffer |
| Density | 1,023kg/m³sourcetypical6.45x lighter | 6,600kg/m³sourcetypical |
| Strength to weight | 18kN·m/kg | 33.5kN·m/kg1.86x higher |
| Stiffness to weight | 1.55MN·m/kg | 13MN·m/kg8.35x higher |
| Poisson's ratio | not sourced | 0.27sourcetypical, Zamak 3 hot-chamber die cast |
| Shear modulus | not sourced | 33.7GPa |
| Bulk modulus | not sourced | 62GPa |
| Speed of sound | 1,246m/s | 3,599m/s |
| Thermal | ||
| Thermal conductivity | 0.17W/m·Ksourcebase material: INEOS Styrolution PS 486N injection-molding HIPS, typical | 113W/m·Ksourcetypical |
| Thermal expansion | 80µm/m·Ksourcebase material: INEOS Styrolution PS 486N injection-molding HIPS, typical | 27.4µm/m·Ksourcetypical |
| 100 mm part over a 50 °C swing | 400µm growth | 137µm growth2.92x less |
| Specific heat | not sourced | 419J/kg·Ksourcetypical |
| Heats up and cools (diffusivity) | not sourced | 40.9mm²/s |
| Thermal shock resistance | not sourced | 7,782W/m |
| Melting point | not sourced | 381–387°Csourcemelting range |
| Glass transition | 99°Csourcetypical | not sourced |
| Max service temperature | 86°CsourceHDT 1.8 MPa | not sourced |
| Values for | BASF Forward AM (BASF 3D Printing Solutions) Ultrafuse HiPS, TDS v2.2 (13.11.2019), printed specimens, XY 'Flat'. Specimen print settings are not stated; recommended processing on the sheet: nozzle 240-260 °C, bed 100-120 °C, 40-80 mm/s. Product is discontinued (Forward AM product page) but the TDS is still served by Forward AM. | Zamak 3 (ASTM B86 die cast), Nathan Trotter (zinc alloy producer) technical data sheet, typical values |
Every value links to the document that states it. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.
FDM HIPS is 3D printed: its properties depend on build direction and print settings; these are typical values.
Questions
Is FDM HIPS stronger than Zinc Zamak 3?
Zinc Zamak 3 is stronger: its yield strength is 221 MPa against tensile strength 18.4 MPa for FDM HIPS (12x).
Which is lighter, FDM HIPS or Zinc Zamak 3?
FDM HIPS is lighter: 1,023 kg/m³ against 6,600 kg/m³ for Zinc Zamak 3.
Which is stiffer, FDM HIPS or Zinc Zamak 3?
Zinc Zamak 3 is stiffer: Young's modulus 85.5 GPa against 1.59 GPa for FDM HIPS, so the same part in Zinc Zamak 3 deflects less under the same load.
Which is lighter for the same job, FDM HIPS or Zinc Zamak 3?
For the same stiffness or strength: FDM HIPS is lighter for a stiff panel or plate, strong beam, strong panel or plate; Zinc Zamak 3 is lighter for a stiff rod or tie (tension), stiff beam (bending), strong rod or tie.
| Part that must be | FDM HIPS | Zinc Zamak 3 |
|---|---|---|
| Stiff rod or tie (tension) | 8.35x heavier | lighter |
| Stiff beam (bending) | 14% heavier | lighter |
| Stiff panel or plate | lighter | 1.71x heavier |
| Strong rod or tie | 1.86x heavier | lighter |
| Strong beam | lighter | 23% heavier |
| Strong panel or plate | lighter | 1.86x heavier |
For the same stiffness or strength, mass scales with density over stiffness (or strength) raised to a power set by how the part is loaded: 1 for a rod in tension, 1/2 for a beam in bending, 1/3 for a panel (the standard material-selection indices).
Which conducts heat better, FDM HIPS or Zinc Zamak 3?
Zinc Zamak 3 conducts heat better: 113 W/m·K against 0.17 W/m·K for FDM HIPS.
Which expands less with temperature?
Zinc Zamak 3 expands less: 27.4 µm/m·K against 80 µm/m·K for FDM HIPS.