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PCB Board FR-4, 2 copper planes vs. Plastic ABS
Compare PCB Board FR-4, 2 copper planes vs. Plastic ABS strength, stiffness, weight and thermal properties.
| Try it on a partA sample part to run stress or thermal on, free in your browser | Open in LessCAD | Open in LessCAD |
|---|---|---|
| Mechanical | ||
| Yield strength | not given (tensile used) | 38.1MPasourcetypical |
| Ultimate tensile strength | 246–385MPasourcethe bare laminate's (fr4-370hr), in-plane: cross direction .. length direction (ASTM D3039) | 38.1MPasourcetypical, peak stress (= stress at yield) |
| Flexural strength | not sourced | 61.1MPasourcetypical |
| Elongation at break | not sourced | 4.6%sourcetypical |
| Young's modulus (stiffness) | 21.9–25.8GPasourcethe bare laminate's (fr4-370hr), in-plane: cross direction .. length direction (ASTM D790-15e2); the copper planes are left out | 1.96GPasourcetypical |
| Density | not sourced | 1,100kg/m³sourcetypical |
| Strength to weight | not sourced | 34.6kN·m/kg |
| Stiffness to weight | not sourced | 1.78MN·m/kg |
| Poisson's ratio | 0.171–0.177sourcethe bare laminate's (fr4-370hr), in-plane: cross direction .. length direction | 0.39sourcebase material: ABS family typical (Covestro Part and Mold Design guide, Table 3-1) |
| Shear modulus | 10.2GPa14.4x stiffer in shear | 0.706GPa |
| Bulk modulus | 12.2GPa | 2.97GPa |
| Speed of sound | not sourced | 1,336m/s |
| Thermal | ||
| Thermal conductivity | not sourced | 0.17W/m·Ksourcebase material: INEOS Styrolution Terluran GP-22 injection-molding ABS, typical |
| Thermal expansion | 13–14µm/m·Ksourcethe bare laminate's (fr4-370hr), in-plane X/Y-axis, below Tg (IPC-TM-650 2.4.24C) | 80–110µm/m·Ksourcebase material: INEOS Styrolution Terluran GP-22 injection-molding ABS, range |
| 100 mm part over a 50 °C swing | 67.5µm growth7.04x less | 475µm growth |
| Specific heat | not sourced | not sourced |
| Heats up and cools (diffusivity) | not sourced | not sourced |
| Thermal shock resistance | not sourced | 21.2W/m |
| Glass transition | not sourced | 101°Csourcetypical |
| Max service temperature | not sourced | 86.6°CsourceHDT 0.455 MPa (printed specimens) |
| Values for | A whole circuit board read as one orthotropic plate: the JEDEC high-K thermal test board (JESD51-7, "2s2p"), 0.062 in (1.575 mm) thick with two internal solid copper planes 0.0014 in (1 oz) thick, as Texas Instruments SZZA017A Table 1 gives it. Copper C110 and the Isola 370HR laminate from this library; the layers conduct in parallel along the board and in series through it (boardStackup.ts). Its two 0.0028 in trace layers cover little of the board and are left out; vias are ignored. Mechanical values are the bare laminate's. | Ultimaker ABS, 3D-printed specimens, XY (flat); Ultimaker S5 Pro, engineering intent profile, 0.15 mm layer height, AA 0.4 print core, 100% infill, Cura 4.9, printed one-at-a-time, conditioned >=24 h at room temperature. TDS v5.00, April 20, 2022. |
Every value links to the document that states it. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.
Plastic ABS is 3D printed: its properties depend on build direction and print settings; these are typical values.
Questions
Is PCB Board FR-4, 2 copper planes stronger than Plastic ABS?
PCB Board FR-4, 2 copper planes is stronger: its tensile strength is 315 MPa against yield strength 38.1 MPa for Plastic ABS (8.28x).
Which is stiffer, PCB Board FR-4, 2 copper planes or Plastic ABS?
PCB Board FR-4, 2 copper planes is stiffer: Young's modulus 23.9 GPa against 1.96 GPa for Plastic ABS, so the same part in PCB Board FR-4, 2 copper planes deflects less under the same load.
Which expands less with temperature?
PCB Board FR-4, 2 copper planes expands less: 13.5 µm/m·K against 95 µm/m·K for Plastic ABS.
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