PCB Board FR-4, 2 copper planes vs. Plastic HDPE

Compare PCB Board FR-4, 2 copper planes vs. Plastic HDPE strength, stiffness, weight and thermal properties.

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PCB Board FR-4, 2 copper planesComposite

Plastic HDPEBulk polymer (molded or machined)

Mechanical
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Yield strength	not given (tensile used)	24MPasourcetypical, tensile stress at yield 23 °C, 50 mm/min ISO 527
Ultimate tensile strength	246–385MPasourcethe bare laminate's (fr4-370hr), in-plane: cross direction .. length direction (ASTM D3039)	not sourced
Elongation at break	not sourced	not sourced
Young's modulus (stiffness)	21.9–25.8GPasourcethe bare laminate's (fr4-370hr), in-plane: cross direction .. length direction (ASTM D790-15e2); the copper planes are left out	0.9GPasourcetypical, tensile modulus 23 °C ISO 527
Density	not sourced	950kg/m³sourcetypical, ISO 1183
Strength to weight	not sourced	25.3kN·m/kg
Stiffness to weight	not sourced	0.947MN·m/kg
Poisson's ratio	0.171–0.177sourcethe bare laminate's (fr4-370hr), in-plane: cross direction .. length direction	0.4–0.45sourcebase material: high-density polyethylene family (INEOS Olefins & Polymers USA, Typical Engineering Properties of HDPE)
Shear modulus	10.2GPa32.2x stiffer in shear	0.316GPa
Bulk modulus	12.2GPa	2GPa
Speed of sound	not sourced	973m/s
Thermal
Thermal conductivity	not sourced	0.4–0.49W/m·Ksourcebase material: high-density polyethylene family (INEOS Olefins & Polymers USA, Typical Engineering Properties of HDPE)
Thermal expansion	13–14µm/m·Ksourcethe bare laminate's (fr4-370hr), in-plane X/Y-axis, below Tg (IPC-TM-650 2.4.24C)	120µm/m·Ksourcebase material: high-density polyethylene family (INEOS Olefins & Polymers USA, Typical Engineering Properties of HDPE)
100 mm part over a 50 °C swing	67.5µm growth8.89x less	600µm growth
Specific heat	not sourced	2,250J/kg·Ksourcebase material: high-density polyethylene family (INEOS Olefins & Polymers USA, Typical Engineering Properties of HDPE)
Heats up and cools (diffusivity)	not sourced	0.208mm²/s
Thermal shock resistance	not sourced	56.9W/m
Values for	A whole circuit board read as one orthotropic plate: the JEDEC high-K thermal test board (JESD51-7, "2s2p"), 0.062 in (1.575 mm) thick with two internal solid copper planes 0.0014 in (1 oz) thick, as Texas Instruments SZZA017A Table 1 gives it. Copper C110 and the Isola 370HR laminate from this library; the layers conduct in parallel along the board and in series through it (boardStackup.ts). Its two 0.0028 in trace layers cover little of the board and are left out; vias are ignored. Mechanical values are the bare laminate's.	LyondellBasell Hostalen 23050 B high density polyethylene, typical ISO values

Every value links to the document that states it. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.

Questions

Is PCB Board FR-4, 2 copper planes stronger than Plastic HDPE?

PCB Board FR-4, 2 copper planes is stronger: its tensile strength is 315 MPa against yield strength 24 MPa for Plastic HDPE (13.1x).

Which is stiffer, PCB Board FR-4, 2 copper planes or Plastic HDPE?

PCB Board FR-4, 2 copper planes is stiffer: Young's modulus 23.9 GPa against 0.9 GPa for Plastic HDPE, so the same part in PCB Board FR-4, 2 copper planes deflects less under the same load.

Which expands less with temperature?

PCB Board FR-4, 2 copper planes expands less: 13.5 µm/m·K against 120 µm/m·K for Plastic HDPE.

Among 73 materials

Stiffness against density

Strength against density