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PCB Board FR-4, 2 copper planes vs. Plastic Nylon PA6
Compare PCB Board FR-4, 2 copper planes vs. Plastic Nylon PA6 strength, stiffness, weight and thermal properties.
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PCB Board FR-4, 2 copper planesComposite
Plastic Nylon PA6Bulk polymer (molded or machined)
| Try it on a partA sample part to run stress or thermal on, free in your browser | Open in LessCAD | Open in LessCAD |
|---|---|---|
| Mechanical | ||
| Yield strength | not given (tensile used) | 90MPasourcetypical, dry |
| Ultimate tensile strength | 246–385MPasourcethe bare laminate's (fr4-370hr), in-plane: cross direction .. length direction (ASTM D3039) | not sourced |
| Elongation at break | not sourced | 10%sourcenominal strain at break, dry |
| Young's modulus (stiffness) | 21.9–25.8GPasourcethe bare laminate's (fr4-370hr), in-plane: cross direction .. length direction (ASTM D790-15e2); the copper planes are left out | 3.5GPasourcetypical, dry |
| Density | not sourced | 1,130kg/m³sourcetypical |
| Strength to weight | not sourced | 79.6kN·m/kg |
| Stiffness to weight | not sourced | 3.1MN·m/kg |
| Poisson's ratio | 0.171–0.177sourcethe bare laminate's (fr4-370hr), in-plane: cross direction .. length direction | 0.4sourcebase material: unfilled polyamide (PA), conditioned, maker design-guide family value (Covestro Table 3-1) |
| Shear modulus | 10.2GPa8.13x stiffer in shear | 1.25GPa |
| Bulk modulus | 12.2GPa | 5.83GPa |
| Speed of sound | not sourced | 1,760m/s |
| Thermal | ||
| Thermal conductivity | not sourced | 0.33W/m·Ksourcetypical |
| Thermal expansion | 13–14µm/m·Ksourcethe bare laminate's (fr4-370hr), in-plane X/Y-axis, below Tg (IPC-TM-650 2.4.24C) | 102µm/m·Ksourcelongitudinal, 23-55 °C |
| 100 mm part over a 50 °C swing | 67.5µm growth7.56x less | 510µm growth |
| Specific heat | not sourced | 1,700J/kg·Ksourcetypical |
| Heats up and cools (diffusivity) | not sourced | 0.172mm²/s |
| Thermal shock resistance | not sourced | 49.9W/m |
| Melting point | not sourced | 220°CsourceDSC |
| Max service temperature | not sourced | 87°CsourceIEC 60216 temperature index, 20000 h |
| Values for | A whole circuit board read as one orthotropic plate: the JEDEC high-K thermal test board (JESD51-7, "2s2p"), 0.062 in (1.575 mm) thick with two internal solid copper planes 0.0014 in (1 oz) thick, as Texas Instruments SZZA017A Table 1 gives it. Copper C110 and the Isola 370HR laminate from this library; the layers conduct in parallel along the board and in series through it (boardStackup.ts). Its two 0.0028 in trace layers cover little of the board and are left out; vias are ignored. Mechanical values are the bare laminate's. | BASF Ultramid B3S (PA6, unreinforced injection-moulding grade), Product Information 02/2026, dry values (ISO methods) |
Every value links to the document that states it. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.
Questions
Is PCB Board FR-4, 2 copper planes stronger than Plastic Nylon PA6?
PCB Board FR-4, 2 copper planes is stronger: its tensile strength is 315 MPa against yield strength 90 MPa for Plastic Nylon PA6 (3.5x).
Which is stiffer, PCB Board FR-4, 2 copper planes or Plastic Nylon PA6?
PCB Board FR-4, 2 copper planes is stiffer: Young's modulus 23.9 GPa against 3.5 GPa for Plastic Nylon PA6, so the same part in PCB Board FR-4, 2 copper planes deflects less under the same load.
Which expands less with temperature?
PCB Board FR-4, 2 copper planes expands less: 13.5 µm/m·K against 102 µm/m·K for Plastic Nylon PA6.
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