PCB Board FR-4, 2 copper planes vs. Plastic UHMWPE

Compare PCB Board FR-4, 2 copper planes vs. Plastic UHMWPE strength, stiffness, weight and thermal properties.

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PCB Board FR-4, 2 copper planesComposite

Plastic UHMWPEBulk polymer (molded or machined)

Mechanical
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Yield strength	not given (tensile used)	20MPasourcetypical, tensile stress at yield ISO 527, 50 mm/min
Ultimate tensile strength	246–385MPasourcethe bare laminate's (fr4-370hr), in-plane: cross direction .. length direction (ASTM D3039)	43MPasourcetypical, tensile stress at break ISO 527, 50 mm/min
Elongation at break	not sourced	465%sourcetypical, nominal elongation at break ISO 527
Young's modulus (stiffness)	21.9–25.8GPasourcethe bare laminate's (fr4-370hr), in-plane: cross direction .. length direction (ASTM D790-15e2); the copper planes are left out	0.66GPasourcetypical, tensile modulus ISO 527, 1 mm/min
Density	not sourced	930kg/m³sourcetypical
Strength to weight	not sourced	21.5kN·m/kg
Stiffness to weight	not sourced	0.71MN·m/kg
Poisson's ratio	0.171–0.177sourcethe bare laminate's (fr4-370hr), in-plane: cross direction .. length direction	not sourced
Shear modulus	10.2GPa	not sourced
Bulk modulus	12.2GPa	not sourced
Speed of sound	not sourced	842m/s
Thermal
Thermal conductivity	not sourced	0.4W/m·Ksourcetypical, unfilled (narrative value, generic Celanese UHMWPE)
Thermal expansion	13–14µm/m·Ksourcethe bare laminate's (fr4-370hr), in-plane X/Y-axis, below Tg (IPC-TM-650 2.4.24C)	200µm/m·Ksourcetypical, 20 to 100 °C (generic Celanese UHMWPE)
100 mm part over a 50 °C swing	67.5µm growth14.8x less	1,000µm growth
Specific heat	not sourced	not sourced
Heats up and cools (diffusivity)	not sourced	not sourced
Thermal shock resistance	not sourced	not sourced
Melting point	not sourced	130–138°CsourceDSC 10 K/min
Max service temperature	not sourced	80°Csourcerecommended max constant operating temperature
Values for	A whole circuit board read as one orthotropic plate: the JEDEC high-K thermal test board (JESD51-7, "2s2p"), 0.062 in (1.575 mm) thick with two internal solid copper planes 0.0014 in (1 oz) thick, as Texas Instruments SZZA017A Table 1 gives it. Copper C110 and the Isola 370HR laminate from this library; the layers conduct in parallel along the board and in series through it (boardStackup.ts). Its two 0.0028 in trace layers cover little of the board and are left out; vias are ignored. Mechanical values are the bare laminate's.	Celanese GUR 4120 (avg. molecular weight 4.7x10^6 g/mol), typical values on compression-molded specimens; CTE and thermal conductivity from Celanese's generic UHMWPE guide (grade not named)

Every value links to the document that states it. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.

Questions

Is PCB Board FR-4, 2 copper planes stronger than Plastic UHMWPE?

PCB Board FR-4, 2 copper planes is stronger: its tensile strength is 315 MPa against yield strength 20 MPa for Plastic UHMWPE (15.8x).

Which is stiffer, PCB Board FR-4, 2 copper planes or Plastic UHMWPE?

PCB Board FR-4, 2 copper planes is stiffer: Young's modulus 23.9 GPa against 0.66 GPa for Plastic UHMWPE, so the same part in PCB Board FR-4, 2 copper planes deflects less under the same load.

Which expands less with temperature?

PCB Board FR-4, 2 copper planes expands less: 13.5 µm/m·K against 200 µm/m·K for Plastic UHMWPE.

Among 73 materials

Stiffness against density

Strength against density