Formlabs Tough 2000 Resin V2 (FLTO2002), TDS Rev. 01 10/06/2025; printed on Form 4 at 100 µm, washed in Form Wash V2 10+5 min in >=99% IPA, post-cured 70 °C for 12 min in Form Cure V2. Orientation not stated.
SAC305 (Sn96.5Ag3.0Cu0.5) solder alloy, bulk; Indium Corporation Indalloy 256 (SAC305) for Preforms product data sheet (Form No. 100346 R0, 2024), selected properties, test temperature not stated; expansion and specific heat from MacDermid Alpha VACULOY SAC TDS (06 September 2023).
Every value links to the document that states it. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.
SLA Resin Tough 2000 is 3D printed: its properties depend on build direction and print settings; these are typical values.
Questions
Is SLA Resin Tough 2000 stronger than Solder SAC305?
SLA Resin Tough 2000 is stronger: its yield strength is 40.4 MPa against 22 MPa for Solder SAC305 (1.84x).
Which is lighter, SLA Resin Tough 2000 or Solder SAC305?
SLA Resin Tough 2000 is lighter: 1,090 kg/m³ against 7,350 kg/m³ for Solder SAC305.
Which is stiffer, SLA Resin Tough 2000 or Solder SAC305?
Solder SAC305 is stiffer: Young's modulus 6.9 GPa against 1.8 GPa for SLA Resin Tough 2000, so the same part in Solder SAC305 deflects less under the same load.
Which is lighter for the same job, SLA Resin Tough 2000 or Solder SAC305?
For the same stiffness or strength: SLA Resin Tough 2000 is lighter for a stiff rod or tie (tension), stiff beam (bending), stiff panel or plate, strong rod or tie, strong beam, strong panel or plate.
Part that must be
SLA Resin Tough 2000
Solder SAC305
Stiff rod or tie (tension)
lighter
1.76x heavier
Stiff beam (bending)
lighter
3.44x heavier
Stiff panel or plate
lighter
4.31x heavier
Strong rod or tie
lighter
12.4x heavier
Strong beam
lighter
10.1x heavier
Strong panel or plate
lighter
9.14x heavier
For the same stiffness or strength, mass scales with density over stiffness (or strength) raised to a power set by how the part is loaded: 1 for a rod in tension, 1/2 for a beam in bending, 1/3 for a panel (the standard material-selection indices).
Which is more ductile, SLA Resin Tough 2000 or Solder SAC305?
SLA Resin Tough 2000 stretches further before it breaks: 79% elongation at break against 49% for Solder SAC305.
Which expands less with temperature?
Solder SAC305 expands less: 21.9 µm/m·K against 134 µm/m·K for SLA Resin Tough 2000.