6063-T6 extruded tube, Kaiser Aluminum Tube & Pipe Alloy 6063 Technical Data (Rev. 05/06), typical properties; specific heat from Hydro EN AW-6063 extruded-products datasheet (Rev.4, 03/2023).
SAC305 (Sn96.5Ag3.0Cu0.5) solder alloy, bulk; Indium Corporation Indalloy 256 (SAC305) for Preforms product data sheet (Form No. 100346 R0, 2024), selected properties, test temperature not stated; expansion and specific heat from MacDermid Alpha VACULOY SAC TDS (06 September 2023).
Every value links to the document that states it. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.
Questions
Is Aluminum 6063-T6 stronger than Solder SAC305?
Aluminum 6063-T6 is stronger: its yield strength is 215 MPa against 22 MPa for Solder SAC305 (9.77x).
Which is lighter, Aluminum 6063-T6 or Solder SAC305?
Aluminum 6063-T6 is lighter: 2,700 kg/m³ against 7,350 kg/m³ for Solder SAC305.
Which is stiffer, Aluminum 6063-T6 or Solder SAC305?
Aluminum 6063-T6 is stiffer: Young's modulus 69 GPa against 6.9 GPa for Solder SAC305, so the same part in Aluminum 6063-T6 deflects less under the same load.
Which is lighter for the same job, Aluminum 6063-T6 or Solder SAC305?
For the same stiffness or strength: Aluminum 6063-T6 is lighter for a stiff rod or tie (tension), stiff beam (bending), stiff panel or plate, strong rod or tie, strong beam, strong panel or plate.
Part that must be
Aluminum 6063-T6
Solder SAC305
Stiff rod or tie (tension)
lighter
27.2x heavier
Stiff beam (bending)
lighter
8.61x heavier
Stiff panel or plate
lighter
5.86x heavier
Strong rod or tie
lighter
26.6x heavier
Strong beam
lighter
12.4x heavier
Strong panel or plate
lighter
8.51x heavier
For the same stiffness or strength, mass scales with density over stiffness (or strength) raised to a power set by how the part is loaded: 1 for a rod in tension, 1/2 for a beam in bending, 1/3 for a panel (the standard material-selection indices).
Which conducts heat better, Aluminum 6063-T6 or Solder SAC305?
Aluminum 6063-T6 conducts heat better: 201 W/m·K against 61 W/m·K for Solder SAC305.
Which expands less with temperature?
Solder SAC305 expands less: 21.9 µm/m·K against 23.4 µm/m·K for Aluminum 6063-T6.