Materials / Compare
Aluminum 7050-T7451 vs. PCB Laminate FR-4
Compare Aluminum 7050-T7451 vs. PCB Laminate FR-4 strength, stiffness, weight and thermal properties.
| Try it on a partA sample part to run stress or thermal on, free in your browser | Open in LessCAD | Open in LessCAD |
|---|---|---|
| Mechanical | ||
| Yield strength | 469MPasourcetypical, longitudinal, 0.2% offset | not given (tensile used) |
| Ultimate tensile strength | 524MPasourcetypical, longitudinal | 246–385MPasourcetypical, in-plane: cross direction .. length direction (ASTM D3039) |
| Flexural strength | not sourced | 531–621MPasourcetypical: cross direction .. length direction (IPC-TM-650 2.4.4B) |
| Elongation at break | 11%sourcetypical, longitudinal | not sourced |
| Young's modulus (stiffness) | 70.3GPasourcetypical | 21.9–25.8GPasourcetypical, in-plane: cross direction .. length direction (ASTM D790-15e2) |
| Density | 2,830kg/m³sourcenominal | 1,920kg/m³sourcetypical, 50% resin content; another FR-4 producer: Park Nelco N4000-6 (high-Tg multifunctional epoxy), not Isola 370HR |
| Strength to weight | 166kN·m/kg | 164kN·m/kg |
| Stiffness to weight | 24.8MN·m/kg2x higher | 12.4MN·m/kg |
| Poisson's ratio | 0.33sourcetypical (handbook physical constant) | 0.171–0.177sourcetypical, in-plane: cross direction .. length direction |
| Shear modulus | 26.4GPa2.6x stiffer in shear | 10.2GPa |
| Bulk modulus | 68.9GPa | 12.2GPa |
| Speed of sound | 4,984m/s | 3,525m/s |
| Thermal | ||
| Thermal conductivity | 157W/m·Ksourcetypical, 20 °C | 0.4W/m·Ksourcetypical (ASTM E1952); direction not stated by the sheet |
| Thermal expansion | 23.5µm/m·Ksourcetypical, mean 20-100 °C | 13–14µm/m·Ksourcetypical, in-plane X/Y-axis, below Tg (IPC-TM-650 2.4.24C) |
| 100 mm part over a 50 °C swing | 118µm growth | 67.5µm growth1.74x less |
| Specific heat | 860J/kg·Ksourcetypical, at 100 °C | 1,200–1,400J/kg·Ksourcetypical (ASTM E1461); another FR-4 producer: Park Nelco N4000-6 (high-Tg multifunctional epoxy), not Isola 370HR |
| Heats up and cools (diffusivity) | 64.5mm²/s403x faster | 0.16mm²/s |
| Thermal shock resistance | 29,862W/m92.3x more resistant | 324W/m |
| Melting point | 524–635°Csourcemelting range | not sourced |
| Glass transition | not sourced | 180°Csourcetypical, DSC (IPC-TM-650 2.4.25C) |
| Max service temperature | not sourced | 130°CsourceUL Relative Thermal Index (UL 796) |
| Values for | 7050-T7451 plate, Kaiser Aluminum sheet, coil & plate typical datasheet (longitudinal); Poisson from MIL-HDBK-5J | Isola 370HR FR-4 laminate (Polyclad PCL-FR-370HR, 180 C Tg multifunctional epoxy, E-glass fabric), copper removed; Isola data sheet Revision C, last updated April 15, 2021. Woven-glass laminate: the sheet gives in-plane values per weave direction (length / cross) and the Z-axis CTE separately; the solver is isotropic per material. |
Every value links to the document that states it. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.
Questions
Is Aluminum 7050-T7451 stronger than PCB Laminate FR-4?
Aluminum 7050-T7451 is stronger: its yield strength is 469 MPa against tensile strength 315 MPa for PCB Laminate FR-4 (49%).
Which is lighter, Aluminum 7050-T7451 or PCB Laminate FR-4?
PCB Laminate FR-4 is lighter: 1,920 kg/m³ against 2,830 kg/m³ for Aluminum 7050-T7451.
Which is stiffer, Aluminum 7050-T7451 or PCB Laminate FR-4?
Aluminum 7050-T7451 is stiffer: Young's modulus 70.3 GPa against 23.9 GPa for PCB Laminate FR-4, so the same part in Aluminum 7050-T7451 deflects less under the same load.
Which is lighter for the same job, Aluminum 7050-T7451 or PCB Laminate FR-4?
For the same stiffness or strength: Aluminum 7050-T7451 is lighter for a stiff rod or tie (tension), stiff beam (bending); PCB Laminate FR-4 is lighter for a stiff panel or plate, strong beam, strong panel or plate.
| Part that must be | Aluminum 7050-T7451 | PCB Laminate FR-4 |
|---|---|---|
| Stiff rod or tie (tension) | lighter | 2x heavier |
| Stiff beam (bending) | lighter | 16% heavier |
| Stiff panel or plate | 3% heavier | lighter |
| Strong rod or tie | about equal | about equal |
| Strong beam | 13% heavier | lighter |
| Strong panel or plate | 21% heavier | lighter |
For the same stiffness or strength, mass scales with density over stiffness (or strength) raised to a power set by how the part is loaded: 1 for a rod in tension, 1/2 for a beam in bending, 1/3 for a panel (the standard material-selection indices).
Which conducts heat better, Aluminum 7050-T7451 or PCB Laminate FR-4?
Aluminum 7050-T7451 conducts heat better: 157 W/m·K against 0.4 W/m·K for PCB Laminate FR-4.
Which expands less with temperature?
PCB Laminate FR-4 expands less: 13.5 µm/m·K against 23.5 µm/m·K for Aluminum 7050-T7451.