C36000 free-cutting brass, H02 half-hard rod 1 in. section (20% cold work), copper.org typical values
SAC305 (Sn96.5Ag3.0Cu0.5) solder alloy, bulk; Indium Corporation Indalloy 256 (SAC305) for Preforms product data sheet (Form No. 100346 R0, 2024), selected properties, test temperature not stated; expansion and specific heat from MacDermid Alpha VACULOY SAC TDS (06 September 2023).
Every value links to the document that states it. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.
Questions
Is Brass C360 stronger than Solder SAC305?
Brass C360 is stronger: its yield strength is 310 MPa against 22 MPa for Solder SAC305 (14.1x).
Which is lighter, Brass C360 or Solder SAC305?
Solder SAC305 is lighter: 7,350 kg/m³ against 8,498 kg/m³ for Brass C360.
Which is stiffer, Brass C360 or Solder SAC305?
Brass C360 is stiffer: Young's modulus 96.5 GPa against 6.9 GPa for Solder SAC305, so the same part in Brass C360 deflects less under the same load.
Which is lighter for the same job, Brass C360 or Solder SAC305?
For the same stiffness or strength: Brass C360 is lighter for a stiff rod or tie (tension), stiff beam (bending), stiff panel or plate, strong rod or tie, strong beam, strong panel or plate.
Part that must be
Brass C360
Solder SAC305
Stiff rod or tie (tension)
lighter
12.1x heavier
Stiff beam (bending)
lighter
3.23x heavier
Stiff panel or plate
lighter
2.08x heavier
Strong rod or tie
lighter
12.2x heavier
Strong beam
lighter
5.05x heavier
Strong panel or plate
lighter
3.25x heavier
For the same stiffness or strength, mass scales with density over stiffness (or strength) raised to a power set by how the part is loaded: 1 for a rod in tension, 1/2 for a beam in bending, 1/3 for a panel (the standard material-selection indices).
Which conducts heat better, Brass C360 or Solder SAC305?
Brass C360 conducts heat better: 116 W/m·K against 61 W/m·K for Solder SAC305.
Which expands less with temperature?
Brass C360 expands less: 20.5 µm/m·K against 21.9 µm/m·K for Solder SAC305.