Thermal conductivity against densityHigher and further left: spreads more heat for its weightThermal expansion against thermal conductivityLower and further right: warps less when heated
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Sources6 documents: Copper Development Association, EOS GmbH, Renishaw, Wieland, U.S. Department of Defense
Copper C10100
C10100 oxygen-free electronic (OFE) copper, annealed to 0.050 mm grain size (OS050), 0.04 in. flat products, copper.org typical values
DMLS AlSi10Mg Aluminum
EOS Aluminium AlSi10Mg (powder 9011-0024), EOS M 290 | 30 µm process (AlSi10Mg_FlexM291 2.01), as manufactured, horizontal; machined (turned) specimens, ISO 6892-1 B10
1
C10100 Alloy (copper.org)Copper Development Associationarchived copyCopper C10100 · Yield strength: typical, 0.5% extension under load, 0.04 in. flatCopper C10100 · Ultimate tensile strength: typical, 0.04 in. flatCopper C10100 · Elongation at break: typical, 0.04 in. flatCopper C10100 · Young's modulus (stiffness): typicalCopper C10100 · Density: nominalCopper C10100 · Thermal conductivity: typical, 20 °CCopper C10100 · Thermal expansion: typical, mean 20-100 °CCopper C10100 · Specific heat: typical, 20 °CCopper C10100 · Melting point: melting point (liquidus = solidus, pure copper)
2
EOS Aluminium AlSi10Mg Material Data SheetEOS GmbHarchived copyDMLS AlSi10Mg Aluminum · Yield strength: typical, as manufactured, horizontalDMLS AlSi10Mg Aluminum · Ultimate tensile strength: typical, as manufactured, horizontalDMLS AlSi10Mg Aluminum · Elongation at break: typical at break, as manufactured, horizontalDMLS AlSi10Mg Aluminum · Thermal conductivity: typical, as manufactured, horizontal (ISO 22007-2)DMLS AlSi10Mg Aluminum · Thermal expansion: mean 25-100 °C, ASTM E228
3
RenAM 500 Series Aluminium AlSi10Mg Material Data SheetRenishawDMLS AlSi10Mg Aluminum · Young's modulus (stiffness): same material and process, different machine maker: Renishaw RenAM 500, 30 µm, as built, horizontal (XY)
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EOS Aluminium AlSi10Mg Material Data Sheet, FlexLine, M 290 (2018)EOS GmbHarchived copyDMLS AlSi10Mg Aluminum · Density: typical part density (ISO 3369), EOS M 290, AlSi10Mg_030_FlexM291 (30 µm)
5
Wieland-K09 (Cu-OFE, C10100) Data SheetWielandCopper C10100 · Poisson's ratio: reference value at room temperature (Wieland-K09 = Cu-OFE = C10100, rolled products)
6
MIL-HDBK-5J, Metallic Materials and Elements for Aerospace Vehicle Structures (2003)U.S. Department of DefenseDMLS AlSi10Mg Aluminum · Poisson's ratio: base material: cast Al-Si-Mg alloy 359.0 (Al-9Si-0.6Mg, closest MIL-HDBK-5J alloy to AlSi10Mg / EN AC-43000)DMLS AlSi10Mg Aluminum · Specific heat: base material: cast Al-Si-Mg alloy 359.0 (MIL-HDBK-5J), at 100 °C
Each number points to the document that states it, with the exact basis. Values without a number are computed from the sourced ones. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.
DMLS AlSi10Mg Aluminum is 3D printed: its properties depend on build direction and print settings; these are typical values.
Questions
Mechanical
Is Copper C10100 stronger than DMLS AlSi10Mg Aluminum?
DMLS AlSi10Mg Aluminum is stronger: its yield strength is 270 MPa against 69 MPa for Copper C10100 (3.91x).
Which is lighter, Copper C10100 or DMLS AlSi10Mg Aluminum?
DMLS AlSi10Mg Aluminum is lighter: 2,670 kg/m³ against 8,941 kg/m³ for Copper C10100.
Which is stiffer, Copper C10100 or DMLS AlSi10Mg Aluminum?
Copper C10100 is stiffer: Young's modulus 117 GPa against 72 GPa for DMLS AlSi10Mg Aluminum, so the same part in Copper C10100 deflects less under the same load.
Which is lighter for the same job, Copper C10100 or DMLS AlSi10Mg Aluminum?
For the same stiffness or strength: DMLS AlSi10Mg Aluminum is lighter for a stiff rod or tie (tension), stiff beam (bending), stiff panel or plate, strong rod or tie, strong beam, strong panel or plate.
Part that must be
Copper C10100
DMLS AlSi10Mg Aluminum
Stiff rod or tie (tension)
2.06x heavier
lighter
Stiff beam (bending)
2.62x heavier
lighter
Stiff panel or plate
2.85x heavier
lighter
Strong rod or tie
13.1x heavier
lighter
Strong beam
8.32x heavier
lighter
Strong panel or plate
6.62x heavier
lighter
For the same stiffness or strength, mass scales with density over stiffness (or strength) raised to a power set by how the part is loaded: 1 for a rod in tension, 1/2 for a beam in bending, 1/3 for a panel (the standard material-selection indices).
Which is more ductile, Copper C10100 or DMLS AlSi10Mg Aluminum?
Copper C10100 stretches further before it breaks: 45% elongation at break against 10.2% for DMLS AlSi10Mg Aluminum.
Thermal
Which conducts heat better, Copper C10100 or DMLS AlSi10Mg Aluminum?
Copper C10100 conducts heat better: 391 W/m·K against 110 W/m·K for DMLS AlSi10Mg Aluminum.
Which expands less with temperature?
Copper C10100 expands less: 16.9 µm/m·K against 20 µm/m·K for DMLS AlSi10Mg Aluminum.