Thermal conductivity against densityHigher and further left: spreads more heat for its weightThermal expansion against thermal conductivityLower and further right: warps less when heated
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Sources5 documents: Copper Development Association, UltiMaker, Wieland, Covestro
Copper C10100
C10100 oxygen-free electronic (OFE) copper, annealed to 0.050 mm grain size (OS050), 0.04 in. flat products, copper.org typical values
FDM Polycarbonate
Ultimaker PC, 3D-printed specimens, XY (flat); Ultimaker S5 Pro, engineering intent profile, 0.15 mm layer height, AA 0.4 print core, 100% infill, Cura 4.9, printed one-at-a-time, conditioned >=24 h at room temperature. TDS (file v5.00), April 20, 2022.
1
C10100 Alloy (copper.org)Copper Development Associationarchived copyCopper C10100 · Yield strength: typical, 0.5% extension under load, 0.04 in. flatCopper C10100 · Ultimate tensile strength: typical, 0.04 in. flatCopper C10100 · Elongation at break: typical, 0.04 in. flatCopper C10100 · Young's modulus (stiffness): typicalCopper C10100 · Density: nominalCopper C10100 · Thermal conductivity: typical, 20 °CCopper C10100 · Thermal expansion: typical, mean 20-100 °CCopper C10100 · Specific heat: typical, 20 °CCopper C10100 · Melting point: melting point (liquidus = solidus, pure copper)
2
Ultimaker PC Technical Data Sheet, v5.00UltiMakerarchived copyFDM Polycarbonate · Yield strength: typicalFDM Polycarbonate · Ultimate tensile strength: typical, peak stress (= stress at yield)FDM Polycarbonate · Flexural strength: typicalFDM Polycarbonate · Elongation at break: typicalFDM Polycarbonate · Young's modulus (stiffness): typicalFDM Polycarbonate · Density: rangeFDM Polycarbonate · Glass transition: typicalFDM Polycarbonate · Max service temperature: HDT 0.455 MPa (printed specimens)
3
Wieland-K09 (Cu-OFE, C10100) Data SheetWielandCopper C10100 · Poisson's ratio: reference value at room temperature (Wieland-K09 = Cu-OFE = C10100, rolled products)
4
Engineering Polymers Part and Mold Design: Thermoplastics, A Design GuideCovestroarchived copyFDM Polycarbonate · Poisson's ratio: base material: polycarbonate family typical (Covestro Part and Mold Design guide, Table 3-1)
5
Makrolon 2405 Technical Data SheetCovestroFDM Polycarbonate · Thermal conductivity: base material: Covestro Makrolon 2405 injection-molding PC, typical, through-plane, 23 °CFDM Polycarbonate · Thermal expansion: base material: Covestro Makrolon 2405 injection-molding PC, typical, 23-55 °C, parallel
Each number points to the document that states it, with the exact basis. Values without a number are computed from the sourced ones. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.
FDM Polycarbonate is 3D printed: its properties depend on build direction and print settings; these are typical values.
Questions
Mechanical
Is Copper C10100 stronger than FDM Polycarbonate?
Copper C10100 is stronger: its yield strength is 69 MPa against 53.3 MPa for FDM Polycarbonate (29%).
Which is lighter, Copper C10100 or FDM Polycarbonate?
FDM Polycarbonate is lighter: 1,190 kg/m³ against 8,941 kg/m³ for Copper C10100.
Which is stiffer, Copper C10100 or FDM Polycarbonate?
Copper C10100 is stiffer: Young's modulus 117 GPa against 2.39 GPa for FDM Polycarbonate, so the same part in Copper C10100 deflects less under the same load.
Which is lighter for the same job, Copper C10100 or FDM Polycarbonate?
For the same stiffness or strength: Copper C10100 is lighter for a stiff rod or tie (tension); FDM Polycarbonate is lighter for a stiff beam (bending), stiff panel or plate, strong rod or tie, strong beam, strong panel or plate.
Part that must be
Copper C10100
FDM Polycarbonate
Stiff rod or tie (tension)
lighter
6.52x heavier
Stiff beam (bending)
7% heavier
lighter
Stiff panel or plate
2.05x heavier
lighter
Strong rod or tie
5.8x heavier
lighter
Strong beam
6.33x heavier
lighter
Strong panel or plate
6.6x heavier
lighter
For the same stiffness or strength, mass scales with density over stiffness (or strength) raised to a power set by how the part is loaded: 1 for a rod in tension, 1/2 for a beam in bending, 1/3 for a panel (the standard material-selection indices).
Which is more ductile, Copper C10100 or FDM Polycarbonate?
Copper C10100 stretches further before it breaks: 45% elongation at break against 9.2% for FDM Polycarbonate.
Thermal
Which conducts heat better, Copper C10100 or FDM Polycarbonate?
Copper C10100 conducts heat better: 391 W/m·K against 0.2 W/m·K for FDM Polycarbonate.
Which expands less with temperature?
Copper C10100 expands less: 16.9 µm/m·K against 65 µm/m·K for FDM Polycarbonate.