Thermal conductivity against densityHigher and further left: spreads more heat for its weightThermal expansion against thermal conductivityLower and further right: warps less when heated
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Sources3 documents: Copper Development Association, Isola, Wieland
Copper C10100
C10100 oxygen-free electronic (OFE) copper, annealed to 0.050 mm grain size (OS050), 0.04 in. flat products, copper.org typical values
PCB Board FR-4, 2 copper planes
A whole circuit board read as one orthotropic plate: the JEDEC high-K thermal test board (JESD51-7, "2s2p"), 0.062 in (1.575 mm) thick with two internal solid copper planes 0.0014 in (1 oz) thick, as Texas Instruments SZZA017A Table 1 gives it. Copper C110 and the Isola 370HR laminate from this library; the layers conduct in parallel along the board and in series through it (boardStackup.ts). Its two 0.0028 in trace layers cover little of the board and are left out; vias are ignored. Mechanical values are the bare laminate's.
1
C10100 Alloy (copper.org)Copper Development Associationarchived copyCopper C10100 · Yield strength: typical, 0.5% extension under load, 0.04 in. flatCopper C10100 · Ultimate tensile strength: typical, 0.04 in. flatCopper C10100 · Elongation at break: typical, 0.04 in. flatCopper C10100 · Young's modulus (stiffness): typicalCopper C10100 · Density: nominalCopper C10100 · Thermal conductivity: typical, 20 °CCopper C10100 · Thermal expansion: typical, mean 20-100 °CCopper C10100 · Specific heat: typical, 20 °CCopper C10100 · Melting point: melting point (liquidus = solidus, pure copper)
2
370HR Laminate and Prepreg Data SheetIsolaarchived copyPCB Board FR-4, 2 copper planes · Ultimate tensile strength: the bare laminate's (fr4-370hr), in-plane: cross direction .. length direction (ASTM D3039)PCB Board FR-4, 2 copper planes · Young's modulus (stiffness): the bare laminate's (fr4-370hr), in-plane: cross direction .. length direction (ASTM D790-15e2); the copper planes are left outPCB Board FR-4, 2 copper planes · Poisson's ratio: the bare laminate's (fr4-370hr), in-plane: cross direction .. length directionPCB Board FR-4, 2 copper planes · Thermal expansion: the bare laminate's (fr4-370hr), in-plane X/Y-axis, below Tg (IPC-TM-650 2.4.24C)
3
Wieland-K09 (Cu-OFE, C10100) Data SheetWielandCopper C10100 · Poisson's ratio: reference value at room temperature (Wieland-K09 = Cu-OFE = C10100, rolled products)
Each number points to the document that states it, with the exact basis. Values without a number are computed from the sourced ones. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.
Questions
Mechanical
Is Copper C10100 stronger than PCB Board FR-4, 2 copper planes?
PCB Board FR-4, 2 copper planes is stronger: its tensile strength is 315 MPa against yield strength 69 MPa for Copper C10100 (4.57x).
Which is stiffer, Copper C10100 or PCB Board FR-4, 2 copper planes?
Copper C10100 is stiffer: Young's modulus 117 GPa against 23.9 GPa for PCB Board FR-4, 2 copper planes, so the same part in Copper C10100 deflects less under the same load.
Thermal
Which expands less with temperature?
PCB Board FR-4, 2 copper planes expands less: 13.5 µm/m·K against 16.9 µm/m·K for Copper C10100.