Thermal conductivity against densityHigher and further left: spreads more heat for its weightThermal expansion against thermal conductivityLower and further right: warps less when heated
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Sources4 documents: Copper Development Association, Indium Corporation, Wieland, MacDermid Alpha
Copper C10100
C10100 oxygen-free electronic (OFE) copper, annealed to 0.050 mm grain size (OS050), 0.04 in. flat products, copper.org typical values
Solder SAC305
SAC305 (Sn96.5Ag3.0Cu0.5) solder alloy, bulk; Indium Corporation Indalloy 256 (SAC305) for Preforms product data sheet (Form No. 100346 R0, 2024), selected properties, test temperature not stated; expansion and specific heat from MacDermid Alpha VACULOY SAC TDS (06 September 2023).
1
C10100 Alloy (copper.org)Copper Development Associationarchived copyCopper C10100 · Yield strength: typical, 0.5% extension under load, 0.04 in. flatCopper C10100 · Ultimate tensile strength: typical, 0.04 in. flatCopper C10100 · Elongation at break: typical, 0.04 in. flatCopper C10100 · Young's modulus (stiffness): typicalCopper C10100 · Density: nominalCopper C10100 · Thermal conductivity: typical, 20 °CCopper C10100 · Thermal expansion: typical, mean 20-100 °CCopper C10100 · Specific heat: typical, 20 °CCopper C10100 · Melting point: melting point (liquidus = solidus, pure copper)
2
Indalloy 256 (SAC305) for Preforms Product Data Sheet (100346 R0)Indium Corporationarchived copySolder SAC305 · Yield strength: typicalSolder SAC305 · Ultimate tensile strength: typicalSolder SAC305 · Elongation at break: typicalSolder SAC305 · Young's modulus (stiffness): typical, temperature and strain rate not statedSolder SAC305 · Density: typicalSolder SAC305 · Poisson's ratio: typicalSolder SAC305 · Thermal conductivity: typical, temperature not statedSolder SAC305 · Melting point: solidus-liquidus
3
Wieland-K09 (Cu-OFE, C10100) Data SheetWielandCopper C10100 · Poisson's ratio: reference value at room temperature (Wieland-K09 = Cu-OFE = C10100, rolled products)
4
ALPHA Vaculoy SAC Alloys Technical Data Sheet (2023)MacDermid AlphaSolder SAC305 · Thermal expansion: mean, 20-100 °C (MacDermid Alpha)Solder SAC305 · Specific heat: typical (MacDermid Alpha)
Each number points to the document that states it, with the exact basis. Values without a number are computed from the sourced ones. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.
Questions
Mechanical
Is Copper C10100 stronger than Solder SAC305?
Copper C10100 is stronger: its yield strength is 69 MPa against 22 MPa for Solder SAC305 (3.14x).
Which is lighter, Copper C10100 or Solder SAC305?
Solder SAC305 is lighter: 7,350 kg/m³ against 8,941 kg/m³ for Copper C10100.
Which is stiffer, Copper C10100 or Solder SAC305?
Copper C10100 is stiffer: Young's modulus 117 GPa against 6.9 GPa for Solder SAC305, so the same part in Copper C10100 deflects less under the same load.
Which is lighter for the same job, Copper C10100 or Solder SAC305?
For the same stiffness or strength: Copper C10100 is lighter for a stiff rod or tie (tension), stiff beam (bending), stiff panel or plate, strong rod or tie, strong beam, strong panel or plate.
Part that must be
Copper C10100
Solder SAC305
Stiff rod or tie (tension)
lighter
14x heavier
Stiff beam (bending)
lighter
3.39x heavier
Stiff panel or plate
lighter
2.11x heavier
Strong rod or tie
lighter
2.58x heavier
Strong beam
lighter
1.76x heavier
Strong panel or plate
lighter
46% heavier
For the same stiffness or strength, mass scales with density over stiffness (or strength) raised to a power set by how the part is loaded: 1 for a rod in tension, 1/2 for a beam in bending, 1/3 for a panel (the standard material-selection indices).
Thermal
Which conducts heat better, Copper C10100 or Solder SAC305?
Copper C10100 conducts heat better: 391 W/m·K against 61 W/m·K for Solder SAC305.
Which expands less with temperature?
Copper C10100 expands less: 16.9 µm/m·K against 21.9 µm/m·K for Solder SAC305.