DMLS AlSi10Mg Aluminum vs. PCB Board FR-4, 2 copper planes

Compare DMLS AlSi10Mg Aluminum vs. PCB Board FR-4, 2 copper planes strength, stiffness, weight and thermal properties.

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DMLS AlSi10Mg Aluminum3D printed metal (DMLS)

PCB Board FR-4, 2 copper planesComposite

Mechanical
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Yield strength	270MPasourcetypical, as manufactured, horizontal	not given (tensile used)
Ultimate tensile strength	450MPasourcetypical, as manufactured, horizontal	246–385MPasourcethe bare laminate's (fr4-370hr), in-plane: cross direction .. length direction (ASTM D3039)
Elongation at break	10.2%sourcetypical at break, as manufactured, horizontal	not sourced
Young's modulus (stiffness)	72GPasourcesame material and process, different machine maker: Renishaw RenAM 500, 30 µm, as built, horizontal (XY)	21.9–25.8GPasourcethe bare laminate's (fr4-370hr), in-plane: cross direction .. length direction (ASTM D790-15e2); the copper planes are left out
Density	2,670kg/m³sourcetypical part density (ISO 3369), EOS M 290, AlSi10Mg_030_FlexM291 (30 µm)	not sourced
Strength to weight	101kN·m/kg	not sourced
Stiffness to weight	27MN·m/kg	not sourced
Poisson's ratio	0.33sourcebase material: cast Al-Si-Mg alloy 359.0 (Al-9Si-0.6Mg, closest MIL-HDBK-5J alloy to AlSi10Mg / EN AC-43000)	0.171–0.177sourcethe bare laminate's (fr4-370hr), in-plane: cross direction .. length direction
Shear modulus	27.1GPa2.66x stiffer in shear	10.2GPa
Bulk modulus	70.6GPa	12.2GPa
Speed of sound	5,193m/s	not sourced
Thermal
Thermal conductivity	110W/m·Ksourcetypical, as manufactured, horizontal (ISO 22007-2)	not sourced
Thermal expansion	20µm/m·Ksourcemean 25-100 °C, ASTM E228	13–14µm/m·Ksourcethe bare laminate's (fr4-370hr), in-plane X/Y-axis, below Tg (IPC-TM-650 2.4.24C)
100 mm part over a 50 °C swing	100µm growth	67.5µm growth48% less
Specific heat	963J/kg·Ksourcebase material: cast Al-Si-Mg alloy 359.0 (MIL-HDBK-5J), at 100 °C	not sourced
Heats up and cools (diffusivity)	42.8mm²/s	not sourced
Thermal shock resistance	13,819W/m	not sourced
Values for	EOS Aluminium AlSi10Mg (powder 9011-0024), EOS M 290 \| 30 µm process (AlSi10Mg_FlexM291 2.01), as manufactured, horizontal; machined (turned) specimens, ISO 6892-1 B10	A whole circuit board read as one orthotropic plate: the JEDEC high-K thermal test board (JESD51-7, "2s2p"), 0.062 in (1.575 mm) thick with two internal solid copper planes 0.0014 in (1 oz) thick, as Texas Instruments SZZA017A Table 1 gives it. Copper C110 and the Isola 370HR laminate from this library; the layers conduct in parallel along the board and in series through it (boardStackup.ts). Its two 0.0028 in trace layers cover little of the board and are left out; vias are ignored. Mechanical values are the bare laminate's.

Every value links to the document that states it. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.

DMLS AlSi10Mg Aluminum is 3D printed: its properties depend on build direction and print settings; these are typical values.

Questions

Is DMLS AlSi10Mg Aluminum stronger than PCB Board FR-4, 2 copper planes?

PCB Board FR-4, 2 copper planes is stronger: its tensile strength is 315 MPa against yield strength 270 MPa for DMLS AlSi10Mg Aluminum (17%).

Which is stiffer, DMLS AlSi10Mg Aluminum or PCB Board FR-4, 2 copper planes?

DMLS AlSi10Mg Aluminum is stiffer: Young's modulus 72 GPa against 23.9 GPa for PCB Board FR-4, 2 copper planes, so the same part in DMLS AlSi10Mg Aluminum deflects less under the same load.

Which expands less with temperature?

PCB Board FR-4, 2 copper planes expands less: 13.5 µm/m·K against 20 µm/m·K for DMLS AlSi10Mg Aluminum.

Among 73 materials

Stiffness against density

Strength against density