Materials / Compare
FDM HIPS vs. Solder SAC305
Compare FDM HIPS vs. Solder SAC305 strength, stiffness, weight and thermal properties.
| Try it on a partA bracket to run stress or thermal on, free in your browser | Open in LessCAD | Open in LessCAD |
|---|---|---|
| Mechanical | ||
| Yield strength | not given (tensile used) | 22MPasourcetypical |
| Ultimate tensile strength | 18.4MPasourcetypical | 39.6MPasourcetypical2.15x stronger |
| Flexural strength | 31.8MPasourcetypical | not sourced |
| Elongation at break | 1.4%sourcetypical | 49%sourcetypical35x more ductile |
| Young's modulus (stiffness) | 1.59GPasourcetypical | 6.9GPasourcetypical, temperature and strain rate not stated |
| Density | 1,023kg/m³sourcetypical7.18x lighter | 7,350kg/m³sourcetypical |
| Strength to weight | 18kN·m/kg6.01x higher | 2.99kN·m/kg |
| Stiffness to weight | 1.55MN·m/kg1.65x higher | 0.939MN·m/kg |
| Poisson's ratio | not sourced | 0.35sourcetypical |
| Shear modulus | not sourced | 2.56GPa |
| Bulk modulus | not sourced | 7.67GPa |
| Speed of sound | 1,246m/s | 969m/s |
| Thermal | ||
| Thermal conductivity | 0.17W/m·Ksourcebase material: INEOS Styrolution PS 486N injection-molding HIPS, typical | 61W/m·Ksourcetypical, temperature not stated |
| Thermal expansion | 80µm/m·Ksourcebase material: INEOS Styrolution PS 486N injection-molding HIPS, typical | 21.9µm/m·Ksourcemean, 20-100 °C (MacDermid Alpha) |
| 100 mm part over a 50 °C swing | 400µm growth | 110µm growth3.65x less |
| Specific heat | not sourced | 232J/kg·Ksourcetypical (MacDermid Alpha) |
| Heats up and cools (diffusivity) | not sourced | 35.8mm²/s |
| Thermal shock resistance | not sourced | 5,773W/m |
| Melting point | not sourced | 217–220°Csourcesolidus-liquidus |
| Glass transition | 99°Csourcetypical | not sourced |
| Max service temperature | 86°CsourceHDT 1.8 MPa | not sourced |
| Values for | BASF Forward AM (BASF 3D Printing Solutions) Ultrafuse HiPS, TDS v2.2 (13.11.2019), printed specimens, XY 'Flat'. Specimen print settings are not stated; recommended processing on the sheet: nozzle 240-260 °C, bed 100-120 °C, 40-80 mm/s. Product is discontinued (Forward AM product page) but the TDS is still served by Forward AM. | SAC305 (Sn96.5Ag3.0Cu0.5) solder alloy, bulk; Indium Corporation Indalloy 256 (SAC305) for Preforms product data sheet (Form No. 100346 R0, 2024), selected properties, test temperature not stated; expansion and specific heat from MacDermid Alpha VACULOY SAC TDS (06 September 2023). |
Every value links to the document that states it. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.
FDM HIPS is 3D printed: its properties depend on build direction and print settings; these are typical values.
Questions
Is FDM HIPS stronger than Solder SAC305?
Solder SAC305 is stronger: its yield strength is 22 MPa against tensile strength 18.4 MPa for FDM HIPS (20%).
Which is lighter, FDM HIPS or Solder SAC305?
FDM HIPS is lighter: 1,023 kg/m³ against 7,350 kg/m³ for Solder SAC305.
Which is stiffer, FDM HIPS or Solder SAC305?
Solder SAC305 is stiffer: Young's modulus 6.9 GPa against 1.59 GPa for FDM HIPS, so the same part in Solder SAC305 deflects less under the same load.
Which is lighter for the same job, FDM HIPS or Solder SAC305?
For the same stiffness or strength: FDM HIPS is lighter for a stiff rod or tie (tension), stiff beam (bending), stiff panel or plate, strong rod or tie, strong beam, strong panel or plate.
| Part that must be | FDM HIPS | Solder SAC305 |
|---|---|---|
| Stiff rod or tie (tension) | lighter | 1.65x heavier |
| Stiff beam (bending) | lighter | 3.45x heavier |
| Stiff panel or plate | lighter | 4.4x heavier |
| Strong rod or tie | lighter | 6.01x heavier |
| Strong beam | lighter | 6.38x heavier |
| Strong panel or plate | lighter | 6.57x heavier |
For the same stiffness or strength, mass scales with density over stiffness (or strength) raised to a power set by how the part is loaded: 1 for a rod in tension, 1/2 for a beam in bending, 1/3 for a panel (the standard material-selection indices).
Which is more ductile, FDM HIPS or Solder SAC305?
Solder SAC305 stretches further before it breaks: 49% elongation at break against 1.4% for FDM HIPS.
Which conducts heat better, FDM HIPS or Solder SAC305?
Solder SAC305 conducts heat better: 61 W/m·K against 0.17 W/m·K for FDM HIPS.
Which expands less with temperature?
Solder SAC305 expands less: 21.9 µm/m·K against 80 µm/m·K for FDM HIPS.