Plastic UHMWPE vs. Solder SAC305

Compare Plastic UHMWPE vs. Solder SAC305 strength, stiffness, weight and thermal properties.

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Plastic UHMWPEBulk polymer (molded or machined)

Mechanical
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Yield strength	20MPasourcetypical, tensile stress at yield ISO 527, 50 mm/min	22MPasourcetypical
Ultimate tensile strength	43MPasourcetypical, tensile stress at break ISO 527, 50 mm/min	39.6MPasourcetypical
Elongation at break	465%sourcetypical, nominal elongation at break ISO 527	49%sourcetypical
Young's modulus (stiffness)	0.66GPasourcetypical, tensile modulus ISO 527, 1 mm/min	6.9GPasourcetypical, temperature and strain rate not stated
Density	930kg/m³sourcetypical7.9x lighter	7,350kg/m³sourcetypical
Strength to weight	21.5kN·m/kg7.18x higher	2.99kN·m/kg
Stiffness to weight	0.71MN·m/kg	0.939MN·m/kg32% higher
Poisson's ratio	not sourced	0.35sourcetypical
Shear modulus	not sourced	2.56GPa
Bulk modulus	not sourced	7.67GPa
Speed of sound	842m/s	969m/s
Thermal
Thermal conductivity	0.4W/m·Ksourcetypical, unfilled (narrative value, generic Celanese UHMWPE)	61W/m·Ksourcetypical, temperature not stated
Thermal expansion	200µm/m·Ksourcetypical, 20 to 100 °C (generic Celanese UHMWPE)	21.9µm/m·Ksourcemean, 20-100 °C (MacDermid Alpha)
100 mm part over a 50 °C swing	1,000µm growth	110µm growth9.13x less
Specific heat	not sourced	232J/kg·Ksourcetypical (MacDermid Alpha)
Heats up and cools (diffusivity)	not sourced	35.8mm²/s
Thermal shock resistance	not sourced	5,773W/m
Melting point	130–138°CsourceDSC 10 K/min	217–220°Csourcesolidus-liquidus
Max service temperature	80°Csourcerecommended max constant operating temperature	not sourced
Values for	Celanese GUR 4120 (avg. molecular weight 4.7x10^6 g/mol), typical values on compression-molded specimens; CTE and thermal conductivity from Celanese's generic UHMWPE guide (grade not named)	SAC305 (Sn96.5Ag3.0Cu0.5) solder alloy, bulk; Indium Corporation Indalloy 256 (SAC305) for Preforms product data sheet (Form No. 100346 R0, 2024), selected properties, test temperature not stated; expansion and specific heat from MacDermid Alpha VACULOY SAC TDS (06 September 2023).

Every value links to the document that states it. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.

Questions

Is Plastic UHMWPE stronger than Solder SAC305?

Solder SAC305 is stronger: its yield strength is 22 MPa against 20 MPa for Plastic UHMWPE (10%).

Which is lighter, Plastic UHMWPE or Solder SAC305?

Plastic UHMWPE is lighter: 930 kg/m³ against 7,350 kg/m³ for Solder SAC305.

Which is stiffer, Plastic UHMWPE or Solder SAC305?

Solder SAC305 is stiffer: Young's modulus 6.9 GPa against 0.66 GPa for Plastic UHMWPE, so the same part in Solder SAC305 deflects less under the same load.

Which is lighter for the same job, Plastic UHMWPE or Solder SAC305?

For the same stiffness or strength: Plastic UHMWPE is lighter for a stiff beam (bending), stiff panel or plate, strong rod or tie, strong beam, strong panel or plate; Solder SAC305 is lighter for a stiff rod or tie (tension).

Part that must be	Plastic UHMWPE	Solder SAC305
Stiff rod or tie (tension)	32% heavier	lighter
Stiff beam (bending)	lighter	2.44x heavier
Stiff panel or plate	lighter	3.61x heavier
Strong rod or tie	lighter	7.18x heavier
Strong beam	lighter	7.42x heavier
Strong panel or plate	lighter	7.54x heavier

For the same stiffness or strength, mass scales with density over stiffness (or strength) raised to a power set by how the part is loaded: 1 for a rod in tension, 1/2 for a beam in bending, 1/3 for a panel (the standard material-selection indices).

Which conducts heat better, Plastic UHMWPE or Solder SAC305?

Solder SAC305 conducts heat better: 61 W/m·K against 0.4 W/m·K for Plastic UHMWPE.

Which expands less with temperature?

Solder SAC305 expands less: 21.9 µm/m·K against 200 µm/m·K for Plastic UHMWPE.

Among 72 materials

Stiffness against density

Strength against density