Materials / Compare
DMLS AlSi10Mg Aluminum vs. Solder SAC305
Compare DMLS AlSi10Mg Aluminum vs. Solder SAC305 strength, stiffness, weight and thermal properties.
| Try it on a partA bracket to run stress or thermal on, free in your browser | Open in LessCAD | Open in LessCAD |
|---|---|---|
| Mechanical | ||
| Yield strength | 270MPasourcetypical, as manufactured, horizontal | 22MPasourcetypical |
| Ultimate tensile strength | 450MPasourcetypical, as manufactured, horizontal | 39.6MPasourcetypical |
| Elongation at break | 10.2%sourcetypical at break, as manufactured, horizontal | 49%sourcetypical |
| Young's modulus (stiffness) | 72GPasourcesame material and process, different machine maker: Renishaw RenAM 500, 30 µm, as built, horizontal (XY) | 6.9GPasourcetypical, temperature and strain rate not stated |
| Density | 2,670kg/m³sourcetypical part density (ISO 3369), EOS M 290, AlSi10Mg_030_FlexM291 (30 µm) | 7,350kg/m³sourcetypical |
| Strength to weight | 101kN·m/kg33.8x higher | 2.99kN·m/kg |
| Stiffness to weight | 27MN·m/kg28.7x higher | 0.939MN·m/kg |
| Poisson's ratio | 0.33sourcebase material: cast Al-Si-Mg alloy 359.0 (Al-9Si-0.6Mg, closest MIL-HDBK-5J alloy to AlSi10Mg / EN AC-43000) | 0.35sourcetypical |
| Shear modulus | 27.1GPa10.6x stiffer in shear | 2.56GPa |
| Bulk modulus | 70.6GPa | 7.67GPa |
| Speed of sound | 5,193m/s | 969m/s |
| Thermal | ||
| Thermal conductivity | 110W/m·Ksourcetypical, as manufactured, horizontal (ISO 22007-2) | 61W/m·Ksourcetypical, temperature not stated |
| Thermal expansion | 20µm/m·Ksourcemean 25-100 °C, ASTM E228 | 21.9µm/m·Ksourcemean, 20-100 °C (MacDermid Alpha) |
| 100 mm part over a 50 °C swing | 100µm growth9% less | 110µm growth |
| Specific heat | 963J/kg·Ksourcebase material: cast Al-Si-Mg alloy 359.0 (MIL-HDBK-5J), at 100 °C | 232J/kg·Ksourcetypical (MacDermid Alpha) |
| Heats up and cools (diffusivity) | 42.8mm²/s20% faster | 35.8mm²/s |
| Thermal shock resistance | 13,819W/m2.39x more resistant | 5,773W/m |
| Melting point | not sourced | 217–220°Csourcesolidus-liquidus |
| Values for | EOS Aluminium AlSi10Mg (powder 9011-0024), EOS M 290 | 30 µm process (AlSi10Mg_FlexM291 2.01), as manufactured, horizontal; machined (turned) specimens, ISO 6892-1 B10 | SAC305 (Sn96.5Ag3.0Cu0.5) solder alloy, bulk; Indium Corporation Indalloy 256 (SAC305) for Preforms product data sheet (Form No. 100346 R0, 2024), selected properties, test temperature not stated; expansion and specific heat from MacDermid Alpha VACULOY SAC TDS (06 September 2023). |
Every value links to the document that states it. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.
DMLS AlSi10Mg Aluminum is 3D printed: its properties depend on build direction and print settings; these are typical values.
Questions
Is DMLS AlSi10Mg Aluminum stronger than Solder SAC305?
DMLS AlSi10Mg Aluminum is stronger: its yield strength is 270 MPa against 22 MPa for Solder SAC305 (12.3x).
Which is lighter, DMLS AlSi10Mg Aluminum or Solder SAC305?
DMLS AlSi10Mg Aluminum is lighter: 2,670 kg/m³ against 7,350 kg/m³ for Solder SAC305.
Which is stiffer, DMLS AlSi10Mg Aluminum or Solder SAC305?
DMLS AlSi10Mg Aluminum is stiffer: Young's modulus 72 GPa against 6.9 GPa for Solder SAC305, so the same part in DMLS AlSi10Mg Aluminum deflects less under the same load.
Which is lighter for the same job, DMLS AlSi10Mg Aluminum or Solder SAC305?
For the same stiffness or strength: DMLS AlSi10Mg Aluminum is lighter for a stiff rod or tie (tension), stiff beam (bending), stiff panel or plate, strong rod or tie, strong beam, strong panel or plate.
| Part that must be | DMLS AlSi10Mg Aluminum | Solder SAC305 |
|---|---|---|
| Stiff rod or tie (tension) | lighter | 28.7x heavier |
| Stiff beam (bending) | lighter | 8.89x heavier |
| Stiff panel or plate | lighter | 6.02x heavier |
| Strong rod or tie | lighter | 33.8x heavier |
| Strong beam | lighter | 14.6x heavier |
| Strong panel or plate | lighter | 9.64x heavier |
For the same stiffness or strength, mass scales with density over stiffness (or strength) raised to a power set by how the part is loaded: 1 for a rod in tension, 1/2 for a beam in bending, 1/3 for a panel (the standard material-selection indices).
Which conducts heat better, DMLS AlSi10Mg Aluminum or Solder SAC305?
DMLS AlSi10Mg Aluminum conducts heat better: 110 W/m·K against 61 W/m·K for Solder SAC305.
Which expands less with temperature?
DMLS AlSi10Mg Aluminum expands less: 20 µm/m·K against 21.9 µm/m·K for Solder SAC305.