Nickel Inconel 718 vs. PCB Board FR-4, 2 copper planes

Compare Nickel Inconel 718 vs. PCB Board FR-4, 2 copper planes strength, stiffness, weight and thermal properties.

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PCB Board FR-4, 2 copper planesComposite

Mechanical
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Yield strength	1,207MPasourcetypical, 1.0 in. hot-rolled bar, 0.2% offset	not given (tensile used)
Ultimate tensile strength	1,389MPasourcetypical, 1.0 in. bar	246–385MPasourcethe bare laminate's (fr4-370hr), in-plane: cross direction .. length direction (ASTM D3039)
Elongation at break	20%sourcetypical, 1.0 in. bar	not sourced
Young's modulus (stiffness)	200GPasourcetypical, 21 °C, annealed + aged	21.9–25.8GPasourcethe bare laminate's (fr4-370hr), in-plane: cross direction .. length direction (ASTM D790-15e2); the copper planes are left out
Density	8,221kg/m³sourcenominal, annealed and aged	not sourced
Strength to weight	147kN·m/kg	not sourced
Stiffness to weight	24.3MN·m/kg	not sourced
Poisson's ratio	0.294sourcetypical, 21 °C, annealed + aged	0.171–0.177sourcethe bare laminate's (fr4-370hr), in-plane: cross direction .. length direction
Shear modulus	77.3GPa7.6x stiffer in shear	10.2GPa
Bulk modulus	162GPa	12.2GPa
Speed of sound	4,932m/s	not sourced
Thermal
Thermal conductivity	11.4W/m·Ksourcetypical, 21 °C, annealed + aged (calculated from resistivity per footnote a)	not sourced
Thermal expansion	13.2µm/m·Ksourcetypical, mean 21-93 °C, annealed + aged	13–14µm/m·Ksourcethe bare laminate's (fr4-370hr), in-plane X/Y-axis, below Tg (IPC-TM-650 2.4.24C)
100 mm part over a 50 °C swing	66µm growth2% less	67.5µm growth
Specific heat	435J/kg·Ksourcetypical, 21 °C	not sourced
Heats up and cools (diffusivity)	3.19mm²/s	not sourced
Thermal shock resistance	3,680W/m	not sourced
Melting point	1,260–1,336°Csourcemelting range	not sourced
Max service temperature	704°Csourceupper use temperature stated by producer	not sourced
Values for	INCONEL alloy 718, standard grade, 1750 °F/1 hr anneal + 1325 °F/8 hr F.C. to 1150 °F aged; Special Metals bulletin SMC-045 typical values	A whole circuit board read as one orthotropic plate: the JEDEC high-K thermal test board (JESD51-7, "2s2p"), 0.062 in (1.575 mm) thick with two internal solid copper planes 0.0014 in (1 oz) thick, as Texas Instruments SZZA017A Table 1 gives it. Copper C110 and the Isola 370HR laminate from this library; the layers conduct in parallel along the board and in series through it (boardStackup.ts). Its two 0.0028 in trace layers cover little of the board and are left out; vias are ignored. Mechanical values are the bare laminate's.

Every value links to the document that states it. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.

Questions

Is Nickel Inconel 718 stronger than PCB Board FR-4, 2 copper planes?

Nickel Inconel 718 is stronger: its yield strength is 1,207 MPa against tensile strength 315 MPa for PCB Board FR-4, 2 copper planes (3.83x).

Which is stiffer, Nickel Inconel 718 or PCB Board FR-4, 2 copper planes?

Nickel Inconel 718 is stiffer: Young's modulus 200 GPa against 23.9 GPa for PCB Board FR-4, 2 copper planes, so the same part in Nickel Inconel 718 deflects less under the same load.

Which expands less with temperature?

Nickel Inconel 718 expands less: 13.2 µm/m·K against 13.5 µm/m·K for PCB Board FR-4, 2 copper planes.

Among 73 materials

Stiffness against density

Strength against density