Materials / Compare
Plastic Nylon vs. Solder SAC305
Compare Plastic Nylon vs. Solder SAC305 strength, stiffness, weight and thermal properties.
| Try it on a partA bracket to run stress or thermal on, free in your browser | Open in LessCAD | Open in LessCAD |
|---|---|---|
| Mechanical | ||
| Yield strength | 63.1MPasourcetypical2.87x stronger | 22MPasourcetypical |
| Ultimate tensile strength | 63.1MPasourcetypical, peak stress (= stress at yield) | 39.6MPasourcetypical |
| Flexural strength | 82.9MPasourcetypical | not sourced |
| Elongation at break | not sourced | 49%sourcetypical |
| Young's modulus (stiffness) | 2.33GPasourcetypical | 6.9GPasourcetypical, temperature and strain rate not stated |
| Density | 1,140kg/m³sourcetypical6.45x lighter | 7,350kg/m³sourcetypical |
| Strength to weight | 55.4kN·m/kg18.5x higher | 2.99kN·m/kg |
| Stiffness to weight | 2.04MN·m/kg2.18x higher | 0.939MN·m/kg |
| Poisson's ratio | 0.4sourcebase material: unfilled polyamide (PA), conditioned, maker design-guide family value (Covestro Table 3-1) | 0.35sourcetypical |
| Shear modulus | 0.833GPa | 2.56GPa3.07x stiffer in shear |
| Bulk modulus | 3.89GPa | 7.67GPa |
| Speed of sound | 1,430m/s | 969m/s |
| Thermal | ||
| Thermal conductivity | 0.33W/m·Ksourcebase material: unreinforced BASF Ultramid PA66 (A3K) and PA6 (B3S), 23 C (same value for both) | 61W/m·Ksourcetypical, temperature not stated |
| Thermal expansion | 98–102µm/m·Ksourcebase material: unreinforced BASF Ultramid PA66 (A3K, 98) and PA6 (B3S, 102), 23-55 C | 21.9µm/m·Ksourcemean, 20-100 °C (MacDermid Alpha) |
| 100 mm part over a 50 °C swing | 500µm growth | 110µm growth4.57x less |
| Specific heat | 1,700J/kg·Ksourcebase material: unreinforced BASF Ultramid PA66 (A3K) and PA6 (B3S), 23 C (same value for both) | 232J/kg·Ksourcetypical (MacDermid Alpha) |
| Heats up and cools (diffusivity) | 0.17mm²/s | 35.8mm²/s210x faster |
| Thermal shock resistance | 53.6W/m | 5,773W/m108x more resistant |
| Melting point | 188°Csourcetypical | 217–220°Csourcesolidus-liquidus |
| Glass transition | 55.1°Csourcetypical | not sourced |
| Max service temperature | 89.2°CsourceHDT 0.455 MPa (printed specimens) | not sourced |
| Values for | Ultimaker Nylon, 3D-printed specimens, XY (flat), conditioned >=24 h at room temperature; Ultimaker S5 Pro, engineering intent profile, 0.15 mm layer height, AA 0.4 print core, 100% infill, Cura 4.9, printed one-at-a-time, conditioned >=24 h at room temperature. TDS v2.00, April 20, 2022. | SAC305 (Sn96.5Ag3.0Cu0.5) solder alloy, bulk; Indium Corporation Indalloy 256 (SAC305) for Preforms product data sheet (Form No. 100346 R0, 2024), selected properties, test temperature not stated; expansion and specific heat from MacDermid Alpha VACULOY SAC TDS (06 September 2023). |
Every value links to the document that states it. "Not sourced" means no citable source states it (or only a specification minimum); figures computed from it are left out too.
Plastic Nylon is 3D printed: its properties depend on build direction and print settings; these are typical values.
Questions
Is Plastic Nylon stronger than Solder SAC305?
Plastic Nylon is stronger: its yield strength is 63.1 MPa against 22 MPa for Solder SAC305 (2.87x).
Which is lighter, Plastic Nylon or Solder SAC305?
Plastic Nylon is lighter: 1,140 kg/m³ against 7,350 kg/m³ for Solder SAC305.
Which is stiffer, Plastic Nylon or Solder SAC305?
Solder SAC305 is stiffer: Young's modulus 6.9 GPa against 2.33 GPa for Plastic Nylon, so the same part in Solder SAC305 deflects less under the same load.
Which is lighter for the same job, Plastic Nylon or Solder SAC305?
For the same stiffness or strength: Plastic Nylon is lighter for a stiff rod or tie (tension), stiff beam (bending), stiff panel or plate, strong rod or tie, strong beam, strong panel or plate.
| Part that must be | Plastic Nylon | Solder SAC305 |
|---|---|---|
| Stiff rod or tie (tension) | lighter | 2.18x heavier |
| Stiff beam (bending) | lighter | 3.75x heavier |
| Stiff panel or plate | lighter | 4.49x heavier |
| Strong rod or tie | lighter | 18.5x heavier |
| Strong beam | lighter | 13x heavier |
| Strong panel or plate | lighter | 10.9x heavier |
For the same stiffness or strength, mass scales with density over stiffness (or strength) raised to a power set by how the part is loaded: 1 for a rod in tension, 1/2 for a beam in bending, 1/3 for a panel (the standard material-selection indices).
Which conducts heat better, Plastic Nylon or Solder SAC305?
Solder SAC305 conducts heat better: 61 W/m·K against 0.33 W/m·K for Plastic Nylon.
Which expands less with temperature?
Solder SAC305 expands less: 21.9 µm/m·K against 100 µm/m·K for Plastic Nylon.